Powerchip Semiconductor Manufacturing Corp
TWSE:6770
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Powerchip Semiconductor Manufacturing Corp
Powerchip Semiconductor Manufacturing Corp
Unrealized Security Profit/Loss
Powerchip Semiconductor Manufacturing Corp
Unrealized Security Profit/Loss Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Unrealized Security Profit/Loss | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
|
Powerchip Semiconductor Manufacturing Corp
TWSE:6770
|
Unrealized Security Profit/Loss
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
ASE Technology Holding Co Ltd
TWSE:3711
|
Unrealized Security Profit/Loss
NT$5.7B
|
CAGR 3-Years
11%
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
Unrealized Security Profit/Loss
-NT$536.3m
|
CAGR 3-Years
19%
|
CAGR 5-Years
10%
|
CAGR 10-Years
N/A
|
|
|
United Microelectronics Corp
TWSE:2303
|
Unrealized Security Profit/Loss
NT$15.9B
|
CAGR 3-Years
21%
|
CAGR 5-Years
N/A
|
CAGR 10-Years
0%
|
|
|
MediaTek Inc
TWSE:2454
|
Unrealized Security Profit/Loss
NT$22.4B
|
CAGR 3-Years
-37%
|
CAGR 5-Years
-11%
|
CAGR 10-Years
N/A
|
|
|
Novatek Microelectronics Corp
TWSE:3034
|
Unrealized Security Profit/Loss
NT$1.9B
|
CAGR 3-Years
-5%
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
Powerchip Semiconductor Manufacturing Corp
Glance View
Powerchip Semiconductor Manufacturing Corp. engages in the research and development, manufacture, and sale of integrated circuits and semiconductor equipment components. The company is headquartered in Hsinchu, Hsinchu. The company went IPO on 2020-12-09. There are two types of semiconductor foundry services, including logic and special application product foundry, providing integrated circuit (IC) design company display driver IC products, power management chip products, discrete component products, complementary metal oxide semiconductor (CMOS) image sensor products, embedded non-volatile memory products, and memory product foundry, providing IC design company dynamic random access memory products, flash memory products. The main product of packaging components is memory particle products. Other design services include photomask services, silicon intellectual property services, design kit services, and others. The products are mainly sold to Asia, America and Europe.
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