Powerchip Semiconductor Manufacturing Corp
TWSE:6770

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Powerchip Semiconductor Manufacturing Corp
TWSE:6770
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Price: 17.6 TWD Market Closed
Market Cap: 73B TWD
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Powerchip Semiconductor Manufacturing Corp
Long-Term Investments

Last Value
3-Years 3-Y CAGR
5-Years 5-Y CAGR
10-Years 10-Y CAGR
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Annual
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Powerchip Semiconductor Manufacturing Corp
Long-Term Investments Peer Comparison

Competitors Analysis
Latest Figures & CAGR of Competitors

Company Long-Term Investments CAGR 3Y CAGR 5Y CAGR 10Y
Powerchip Semiconductor Manufacturing Corp
TWSE:6770
Long-Term Investments
N/A
CAGR 3-Years
N/A
CAGR 5-Years
N/A
CAGR 10-Years
N/A
ASE Technology Holding Co Ltd
TWSE:3711
Long-Term Investments
NT$51.4B
CAGR 3-Years
17%
CAGR 5-Years
14%
CAGR 10-Years
N/A
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
Long-Term Investments
NT$140.2B
CAGR 3-Years
69%
CAGR 5-Years
37%
CAGR 10-Years
17%
United Microelectronics Corp
TWSE:2303
Long-Term Investments
NT$78.4B
CAGR 3-Years
6%
CAGR 5-Years
16%
CAGR 10-Years
8%
MediaTek Inc
TWSE:2454
Long-Term Investments
NT$163.8B
CAGR 3-Years
5%
CAGR 5-Years
27%
CAGR 10-Years
32%
Novatek Microelectronics Corp
TWSE:3034
Long-Term Investments
NT$12.9B
CAGR 3-Years
13%
CAGR 5-Years
58%
CAGR 10-Years
24%
No Stocks Found

Powerchip Semiconductor Manufacturing Corp
Glance View

Market Cap
73B TWD
Industry
Semiconductors

Powerchip Semiconductor Manufacturing Corp. engages in the research and development, manufacture, and sale of integrated circuits and semiconductor equipment components. The company is headquartered in Hsinchu, Hsinchu. The company went IPO on 2020-12-09. There are two types of semiconductor foundry services, including logic and special application product foundry, providing integrated circuit (IC) design company display driver IC products, power management chip products, discrete component products, complementary metal oxide semiconductor (CMOS) image sensor products, embedded non-volatile memory products, and memory product foundry, providing IC design company dynamic random access memory products, flash memory products. The main product of packaging components is memory particle products. Other design services include photomask services, silicon intellectual property services, design kit services, and others. The products are mainly sold to Asia, America and Europe.

Intrinsic Value
27.25 TWD
Undervaluation 35%
Intrinsic Value
Price

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