Tong Hsing Electronic Industries Ltd
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Tong Hsing Electronic Industries Ltd
Tong Hsing Electronics Industries Ltd. is engaged in the manufacturing and selling of electronic products. The company is headquartered in Taipei City, Taipei. The company went IPO on 2002-12-24. The firm's main products include power amplifier modules, ceramic heat sink substrates, hybrid integrated circuits, wafer reorganization, wafer testing, micro display modules, and others. High-frequency wireless communication modules are mainly used in mobile phones, wireless local area networks. The hybrid body circuit mainly uses ceramic circuit boards for the product assembly process, which is divided into thick film and thin film technologies. The ceramic circuit boards are mainly used in aviation, automotive, and medical fields. The imaging products are mainly used in digital cameras, digital cameras, mobile phones and tablet computers. The firm distributes its products to the Americas, Europe and other markets.
Tong Hsing Electronics Industries Ltd. is engaged in the manufacturing and selling of electronic products. The company is headquartered in Taipei City, Taipei. The company went IPO on 2002-12-24. The firm's main products include power amplifier modules, ceramic heat sink substrates, hybrid integrated circuits, wafer reorganization, wafer testing, micro display modules, and others. High-frequency wireless communication modules are mainly used in mobile phones, wireless local area networks. The hybrid body circuit mainly uses ceramic circuit boards for the product assembly process, which is divided into thick film and thin film technologies. The ceramic circuit boards are mainly used in aviation, automotive, and medical fields. The imaging products are mainly used in digital cameras, digital cameras, mobile phones and tablet computers. The firm distributes its products to the Americas, Europe and other markets.