Machvision Inc
TWSE:3563

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Machvision Inc
TWSE:3563
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Price: 425.5 TWD 5.85% Market Closed
Market Cap: 24.7B TWD

Machvision Inc's latest stock split occurred on Sep 25, 2013

The company executed a 1293-for-1258 stock split, meaning that for every 1258 shares held, investors received 1293 new shares.

Before the split, Machvision Inc traded at 73.4414 per share. Afterward, the share price was about 47.267.

The adjusted shares began trading on Sep 25, 2013. This was Machvision Inc's 6th stock split, following the previous one in Jul 12, 2013.

Last Splits:
Sep 25, 2013
1293-for-1258
Jul 12, 2013
11-for-10
Jul 24, 2012
11-for-10
Aug 4, 2011
6-for-5
Aug 26, 2008
113-for-100
Pre-Split Price
46.3927 73.4414
Post-Split Price
47.267
Before
After
Last Splits:
Sep 25, 2013
1293-for-1258
Jul 12, 2013
11-for-10
Jul 24, 2012
11-for-10
Aug 4, 2011
6-for-5
Aug 26, 2008
113-for-100

Machvision Inc
Stock Splits History

Machvision Inc Stock Splits Timeline
Sep 25, 2013
Sep 25, 2013
Split 1293-for-1258
x1.0278219395866
Pre-Split Price
46.3927 73.4414
Post-Split Price
47.267
Before
After
Jul 12, 2013
Jul 12, 2013
Split 11-for-10
x1.1
Pre-Split Price
38.8084 70.6037
Post-Split Price
47.6976
Before
After
Jul 24, 2012
Jul 24, 2012
Split 11-for-10
x1.1
Pre-Split Price
24.3193 52.2433
Post-Split Price
24.803
Before
After
Aug 4, 2011
Aug 4, 2011
Split 6-for-5
x1.2
Pre-Split Price
N/A
Post-Split Price
24.366
Before
After
Aug 26, 2008
Aug 26, 2008
Split 113-for-100
x1.13
Pre-Split Price
N/A
Post-Split Price
24.366
Before
After
Jul 30, 2007
Jul 30, 2007
Split 47-for-40
x1.175
Pre-Split Price
N/A
Post-Split Price
24.366
Before
After

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Machvision Inc
Glance View

Market Cap
24.7B TWD
Industry
Semiconductors

MACHVISION, Inc. engages in the manufacture and provision of semiconductors and printed circuit board inspection service products. The company is headquartered in Hsinchu, Hsinchu. The company went IPO on 2007-06-27. The firm's products include PCB drill bit inspection systems, PCB line inspection equipment and high density interconnect (HDI) and integrated circuit (IC) substrate inspection equipment. The firm is also engaged in the provision of equipment maintenance services. The firm provides three categories of technologies: advanced visual interface (AVI) technology, two dimensional (2D) and three dimensional (3D) measurement technology and automated optical inspection (AOI) technology. The firm operates its business within domestic market and to overseas markets.

Intrinsic Value
115.23 TWD
Overvaluation 73%
Intrinsic Value
Price
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