Shenmao Technology Inc
TWSE:3305
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Shenmao Technology Inc
Shenmao Technology Inc
Cash Paid for Dividends
Shenmao Technology Inc
Cash Paid for Dividends Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Cash Paid for Dividends | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
|
Shenmao Technology Inc
TWSE:3305
|
Cash Paid for Dividends
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
A
|
Apex Dynamics Inc
TWSE:4583
|
Cash Paid for Dividends
-NT$801.7m
|
CAGR 3-Years
-20%
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
Hiwin Technologies Corp
TWSE:2049
|
Cash Paid for Dividends
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
C
|
C Sun Mfg Ltd
TWSE:2467
|
Cash Paid for Dividends
-NT$449.2m
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
-7%
|
|
|
K
|
Kinik Co
TWSE:1560
|
Cash Paid for Dividends
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
Shin Zu Shing Co Ltd
TWSE:3376
|
Cash Paid for Dividends
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
Shenmao Technology Inc
Glance View
SHENMAO Technology Inc. engages in the manufacture and sale of solder products. The company is headquartered in Taoyuan, Taoyuan. The company went IPO on 2004-06-09. The firm's main products include solder wires, solder bars, solder paste, solder balls, ball grid array (BGA) solder balls, metal materials, tin powder and others. The firm's products are mainly used in computers, network communications and consumer electronics. The firm distributes its products in domestic market and to overseas markets, including mainland China, Malaysia, Thailand and others.
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