Kinsus Interconnect Technology Corp
TWSE:3189
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Kinsus Interconnect Technology Corp
Non-Reccuring Items
Kinsus Interconnect Technology Corp
Non-Reccuring Items Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
Company | Non-Reccuring Items | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
---|---|---|---|---|---|---|
Kinsus Interconnect Technology Corp
TWSE:3189
|
Non-Reccuring Items
N/A
|
CAGR 3-Years
N/A
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CAGR 5-Years
N/A
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CAGR 10-Years
N/A
|
||
ASE Technology Holding Co Ltd
TWSE:3711
|
Non-Reccuring Items
NT$447.4m
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
||
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
Non-Reccuring Items
-NT$27.6m
|
CAGR 3-Years
-417%
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
||
United Microelectronics Corp
TWSE:2303
|
Non-Reccuring Items
NT$664.6m
|
CAGR 3-Years
-17%
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
||
MediaTek Inc
TWSE:2454
|
Non-Reccuring Items
-NT$74.2m
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
13%
|
||
Novatek Microelectronics Corp
TWSE:3034
|
Non-Reccuring Items
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
Kinsus Interconnect Technology Corp
Glance View
Kinsus Interconnect Technology Corp. engages in the manufacture and sale of electronic components. The company is headquartered in Taoyuan, Taoyuan. The company went IPO on 2003-09-01. The Company’s products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, cavity down substrates, thermal enhanced-BGA substrates, flip chip substrates, flip chip CSP substrates and others. Its products are applied in the manufacture of chipsets, graphic chips, analog integrated circuits (ICs), logic ICs, flash memory products and dynamic random access memory (DRAM) products and others. The firm distributes its products in Taiwan, Mainland China, the United States, Europe and others.