Kinsus Interconnect Technology Corp
TWSE:3189
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Kinsus Interconnect Technology Corp
Kinsus Interconnect Technology Corp
Change in Working Capital
Kinsus Interconnect Technology Corp
Change in Working Capital Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Change in Working Capital | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
|
Kinsus Interconnect Technology Corp
TWSE:3189
|
Change in Working Capital
-NT$3.7B
|
CAGR 3-Years
-92%
|
CAGR 5-Years
N/A
|
CAGR 10-Years
-14%
|
|
|
ASE Technology Holding Co Ltd
TWSE:3711
|
Change in Working Capital
-NT$1.6B
|
CAGR 3-Years
59%
|
CAGR 5-Years
35%
|
CAGR 10-Years
N/A
|
|
|
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
Change in Working Capital
-NT$148.2B
|
CAGR 3-Years
-3%
|
CAGR 5-Years
-9%
|
CAGR 10-Years
-18%
|
|
|
United Microelectronics Corp
TWSE:2303
|
Change in Working Capital
-NT$8.3B
|
CAGR 3-Years
N/A
|
CAGR 5-Years
-30%
|
CAGR 10-Years
-3%
|
|
|
MediaTek Inc
TWSE:2454
|
Change in Working Capital
NT$69.5B
|
CAGR 3-Years
122%
|
CAGR 5-Years
234%
|
CAGR 10-Years
27%
|
|
|
Novatek Microelectronics Corp
TWSE:3034
|
Change in Working Capital
-NT$5.7B
|
CAGR 3-Years
18%
|
CAGR 5-Years
-25%
|
CAGR 10-Years
-7%
|
|
Kinsus Interconnect Technology Corp
Glance View
Kinsus Interconnect Technology Corp. engages in the manufacture and sale of electronic components. The company is headquartered in Taoyuan, Taoyuan. The company went IPO on 2003-09-01. The Company’s products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, cavity down substrates, thermal enhanced-BGA substrates, flip chip substrates, flip chip CSP substrates and others. Its products are applied in the manufacture of chipsets, graphic chips, analog integrated circuits (ICs), logic ICs, flash memory products and dynamic random access memory (DRAM) products and others. The firm distributes its products in Taiwan, Mainland China, the United States, Europe and others.
See Also
What is Kinsus Interconnect Technology Corp's Change in Working Capital?
Change in Working Capital
-3.7B
TWD
Based on the financial report for Jun 30, 2024, Kinsus Interconnect Technology Corp's Change in Working Capital amounts to -3.7B TWD.
What is Kinsus Interconnect Technology Corp's Change in Working Capital growth rate?
Change in Working Capital CAGR 10Y
-14%
The average annual Change in Working Capital growth rates for Kinsus Interconnect Technology Corp have been -92% over the past three years , and -14% over the past ten years .
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