Kinsus Interconnect Technology Corp
TWSE:3189
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Kinsus Interconnect Technology Corp
Kinsus Interconnect Technology Corp
Total Liabilities & Equity
Kinsus Interconnect Technology Corp
Total Liabilities & Equity Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Total Liabilities & Equity | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
|
Kinsus Interconnect Technology Corp
TWSE:3189
|
Total Liabilities & Equity
NT$80.2B
|
CAGR 3-Years
16%
|
CAGR 5-Years
14%
|
CAGR 10-Years
7%
|
|
|
ASE Technology Holding Co Ltd
TWSE:3711
|
Total Liabilities & Equity
NT$682.9B
|
CAGR 3-Years
4%
|
CAGR 5-Years
5%
|
CAGR 10-Years
N/A
|
|
|
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
Total Liabilities & Equity
NT$6T
|
CAGR 3-Years
25%
|
CAGR 5-Years
22%
|
CAGR 10-Years
16%
|
|
|
United Microelectronics Corp
TWSE:2303
|
Total Liabilities & Equity
NT$587B
|
CAGR 3-Years
12%
|
CAGR 5-Years
10%
|
CAGR 10-Years
7%
|
|
|
MediaTek Inc
TWSE:2454
|
Total Liabilities & Equity
NT$681.4B
|
CAGR 3-Years
3%
|
CAGR 5-Years
9%
|
CAGR 10-Years
8%
|
|
|
Novatek Microelectronics Corp
TWSE:3034
|
Total Liabilities & Equity
NT$96.8B
|
CAGR 3-Years
-2%
|
CAGR 5-Years
15%
|
CAGR 10-Years
8%
|
|
Kinsus Interconnect Technology Corp
Glance View
Kinsus Interconnect Technology Corp. engages in the manufacture and sale of electronic components. The company is headquartered in Taoyuan, Taoyuan. The company went IPO on 2003-09-01. The Company’s products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, cavity down substrates, thermal enhanced-BGA substrates, flip chip substrates, flip chip CSP substrates and others. Its products are applied in the manufacture of chipsets, graphic chips, analog integrated circuits (ICs), logic ICs, flash memory products and dynamic random access memory (DRAM) products and others. The firm distributes its products in Taiwan, Mainland China, the United States, Europe and others.
See Also
What is Kinsus Interconnect Technology Corp's Total Liabilities & Equity?
Total Liabilities & Equity
80.2B
TWD
Based on the financial report for Jun 30, 2024, Kinsus Interconnect Technology Corp's Total Liabilities & Equity amounts to 80.2B TWD.
What is Kinsus Interconnect Technology Corp's Total Liabilities & Equity growth rate?
Total Liabilities & Equity CAGR 10Y
7%
Over the last year, the Total Liabilities & Equity growth was 7%. The average annual Total Liabilities & Equity growth rates for Kinsus Interconnect Technology Corp have been 16% over the past three years , 14% over the past five years , and 7% over the past ten years .
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