Kinsus Interconnect Technology Corp
TWSE:3189
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Kinsus Interconnect Technology Corp
Kinsus Interconnect Technology Corp
Total Liabilities
Kinsus Interconnect Technology Corp
Total Liabilities Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Total Liabilities | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
|
Kinsus Interconnect Technology Corp
TWSE:3189
|
Total Liabilities
NT$48.7B
|
CAGR 3-Years
26%
|
CAGR 5-Years
25%
|
CAGR 10-Years
13%
|
|
|
ASE Technology Holding Co Ltd
TWSE:3711
|
Total Liabilities
NT$380.6B
|
CAGR 3-Years
1%
|
CAGR 5-Years
3%
|
CAGR 10-Years
N/A
|
|
|
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
Total Liabilities
NT$2.2T
|
CAGR 3-Years
26%
|
CAGR 5-Years
26%
|
CAGR 10-Years
17%
|
|
|
United Microelectronics Corp
TWSE:2303
|
Total Liabilities
NT$231.2B
|
CAGR 3-Years
8%
|
CAGR 5-Years
7%
|
CAGR 10-Years
10%
|
|
|
MediaTek Inc
TWSE:2454
|
Total Liabilities
NT$296.8B
|
CAGR 3-Years
7%
|
CAGR 5-Years
12%
|
CAGR 10-Years
10%
|
|
|
Novatek Microelectronics Corp
TWSE:3034
|
Total Liabilities
NT$33.4B
|
CAGR 3-Years
-9%
|
CAGR 5-Years
15%
|
CAGR 10-Years
5%
|
|
Kinsus Interconnect Technology Corp
Glance View
Kinsus Interconnect Technology Corp. engages in the manufacture and sale of electronic components. The company is headquartered in Taoyuan, Taoyuan. The company went IPO on 2003-09-01. The Company’s products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, cavity down substrates, thermal enhanced-BGA substrates, flip chip substrates, flip chip CSP substrates and others. Its products are applied in the manufacture of chipsets, graphic chips, analog integrated circuits (ICs), logic ICs, flash memory products and dynamic random access memory (DRAM) products and others. The firm distributes its products in Taiwan, Mainland China, the United States, Europe and others.
See Also
What is Kinsus Interconnect Technology Corp's Total Liabilities?
Total Liabilities
48.7B
TWD
Based on the financial report for Jun 30, 2024, Kinsus Interconnect Technology Corp's Total Liabilities amounts to 48.7B TWD.
What is Kinsus Interconnect Technology Corp's Total Liabilities growth rate?
Total Liabilities CAGR 10Y
13%
Over the last year, the Total Liabilities growth was 12%. The average annual Total Liabilities growth rates for Kinsus Interconnect Technology Corp have been 26% over the past three years , 25% over the past five years , and 13% over the past ten years .
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