Kinsus Interconnect Technology Corp
TWSE:3189
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Kinsus Interconnect Technology Corp
Kinsus Interconnect Technology Corp
Other Current Liabilities
Kinsus Interconnect Technology Corp
Other Current Liabilities Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Other Current Liabilities | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
|
Kinsus Interconnect Technology Corp
TWSE:3189
|
Other Current Liabilities
NT$6.1B
|
CAGR 3-Years
20%
|
CAGR 5-Years
41%
|
CAGR 10-Years
1%
|
|
|
ASE Technology Holding Co Ltd
TWSE:3711
|
Other Current Liabilities
NT$83.1B
|
CAGR 3-Years
18%
|
CAGR 5-Years
13%
|
CAGR 10-Years
N/A
|
|
|
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
Other Current Liabilities
NT$509.6B
|
CAGR 3-Years
18%
|
CAGR 5-Years
7%
|
CAGR 10-Years
14%
|
|
|
United Microelectronics Corp
TWSE:2303
|
Other Current Liabilities
NT$100B
|
CAGR 3-Years
21%
|
CAGR 5-Years
27%
|
CAGR 10-Years
14%
|
|
|
MediaTek Inc
TWSE:2454
|
Other Current Liabilities
NT$175.4B
|
CAGR 3-Years
14%
|
CAGR 5-Years
32%
|
CAGR 10-Years
12%
|
|
|
Novatek Microelectronics Corp
TWSE:3034
|
Other Current Liabilities
NT$11.2B
|
CAGR 3-Years
-9%
|
CAGR 5-Years
16%
|
CAGR 10-Years
11%
|
|
Kinsus Interconnect Technology Corp
Glance View
Kinsus Interconnect Technology Corp. engages in the manufacture and sale of electronic components. The company is headquartered in Taoyuan, Taoyuan. The company went IPO on 2003-09-01. The Company’s products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, cavity down substrates, thermal enhanced-BGA substrates, flip chip substrates, flip chip CSP substrates and others. Its products are applied in the manufacture of chipsets, graphic chips, analog integrated circuits (ICs), logic ICs, flash memory products and dynamic random access memory (DRAM) products and others. The firm distributes its products in Taiwan, Mainland China, the United States, Europe and others.
See Also
What is Kinsus Interconnect Technology Corp's Other Current Liabilities?
Other Current Liabilities
6.1B
TWD
Based on the financial report for Jun 30, 2024, Kinsus Interconnect Technology Corp's Other Current Liabilities amounts to 6.1B TWD.
What is Kinsus Interconnect Technology Corp's Other Current Liabilities growth rate?
Other Current Liabilities CAGR 10Y
1%
Over the last year, the Other Current Liabilities growth was -3%. The average annual Other Current Liabilities growth rates for Kinsus Interconnect Technology Corp have been 20% over the past three years , 41% over the past five years , and 1% over the past ten years .
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