Kinsus Interconnect Technology Corp
TWSE:3189
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Kinsus Interconnect Technology Corp
Kinsus Interconnect Technology Corp
Current Portion of Long-Term Debt
Kinsus Interconnect Technology Corp
Current Portion of Long-Term Debt Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Current Portion of Long-Term Debt | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
|
Kinsus Interconnect Technology Corp
TWSE:3189
|
Current Portion of Long-Term Debt
NT$2.2B
|
CAGR 3-Years
37%
|
CAGR 5-Years
9%
|
CAGR 10-Years
5%
|
|
|
ASE Technology Holding Co Ltd
TWSE:3711
|
Current Portion of Long-Term Debt
NT$19.9B
|
CAGR 3-Years
44%
|
CAGR 5-Years
23%
|
CAGR 10-Years
N/A
|
|
|
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
Current Portion of Long-Term Debt
NT$25.7B
|
CAGR 3-Years
140%
|
CAGR 5-Years
-13%
|
CAGR 10-Years
N/A
|
|
|
United Microelectronics Corp
TWSE:2303
|
Current Portion of Long-Term Debt
NT$13.7B
|
CAGR 3-Years
-3%
|
CAGR 5-Years
-10%
|
CAGR 10-Years
6%
|
|
|
MediaTek Inc
TWSE:2454
|
Current Portion of Long-Term Debt
NT$8.2B
|
CAGR 3-Years
30%
|
CAGR 5-Years
44%
|
CAGR 10-Years
73%
|
|
|
Novatek Microelectronics Corp
TWSE:3034
|
Current Portion of Long-Term Debt
NT$49.6m
|
CAGR 3-Years
19%
|
CAGR 5-Years
-2%
|
CAGR 10-Years
N/A
|
|
Kinsus Interconnect Technology Corp
Glance View
Kinsus Interconnect Technology Corp. engages in the manufacture and sale of electronic components. The company is headquartered in Taoyuan, Taoyuan. The company went IPO on 2003-09-01. The Company’s products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, cavity down substrates, thermal enhanced-BGA substrates, flip chip substrates, flip chip CSP substrates and others. Its products are applied in the manufacture of chipsets, graphic chips, analog integrated circuits (ICs), logic ICs, flash memory products and dynamic random access memory (DRAM) products and others. The firm distributes its products in Taiwan, Mainland China, the United States, Europe and others.
See Also
What is Kinsus Interconnect Technology Corp's Current Portion of Long-Term Debt?
Current Portion of Long-Term Debt
2.2B
TWD
Based on the financial report for Jun 30, 2024, Kinsus Interconnect Technology Corp's Current Portion of Long-Term Debt amounts to 2.2B TWD.
What is Kinsus Interconnect Technology Corp's Current Portion of Long-Term Debt growth rate?
Current Portion of Long-Term Debt CAGR 10Y
5%
Over the last year, the Current Portion of Long-Term Debt growth was 18%. The average annual Current Portion of Long-Term Debt growth rates for Kinsus Interconnect Technology Corp have been 37% over the past three years , 9% over the past five years , and 5% over the past ten years .
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