Kinsus Interconnect Technology Corp
TWSE:3189

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Kinsus Interconnect Technology Corp
TWSE:3189
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Price: 96 TWD 0.52% Market Closed
Market Cap: 43.8B TWD
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Kinsus Interconnect Technology Corp
Accrued Liabilities

Last Value
3-Years 3-Y CAGR
5-Years 5-Y CAGR
10-Years 10-Y CAGR
Quarterly
Annual
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Kinsus Interconnect Technology Corp
Accrued Liabilities Peer Comparison

Competitors Analysis
Latest Figures & CAGR of Competitors

Company Accrued Liabilities CAGR 3Y CAGR 5Y CAGR 10Y
Kinsus Interconnect Technology Corp
TWSE:3189
Accrued Liabilities
NT$3.6B
CAGR 3-Years
3%
CAGR 5-Years
6%
CAGR 10-Years
N/A
ASE Technology Holding Co Ltd
TWSE:3711
Accrued Liabilities
NT$18.1B
CAGR 3-Years
-3%
CAGR 5-Years
5%
CAGR 10-Years
N/A
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
Accrued Liabilities
NT$449.7B
CAGR 3-Years
44%
CAGR 5-Years
37%
CAGR 10-Years
25%
United Microelectronics Corp
TWSE:2303
Accrued Liabilities
N/A
CAGR 3-Years
N/A
CAGR 5-Years
N/A
CAGR 10-Years
N/A
MediaTek Inc
TWSE:2454
Accrued Liabilities
NT$41.4B
CAGR 3-Years
7%
CAGR 5-Years
16%
CAGR 10-Years
N/A
Novatek Microelectronics Corp
TWSE:3034
Accrued Liabilities
N/A
CAGR 3-Years
N/A
CAGR 5-Years
N/A
CAGR 10-Years
N/A
No Stocks Found

Kinsus Interconnect Technology Corp
Glance View

Market Cap
43.6B TWD
Industry
Semiconductors

Kinsus Interconnect Technology Corp. engages in the manufacture and sale of electronic components. The company is headquartered in Taoyuan, Taoyuan. The company went IPO on 2003-09-01. The Company’s products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, cavity down substrates, thermal enhanced-BGA substrates, flip chip substrates, flip chip CSP substrates and others. Its products are applied in the manufacture of chipsets, graphic chips, analog integrated circuits (ICs), logic ICs, flash memory products and dynamic random access memory (DRAM) products and others. The firm distributes its products in Taiwan, Mainland China, the United States, Europe and others.

Intrinsic Value
125.02 TWD
Undervaluation 23%
Intrinsic Value
Price

See Also

What is Kinsus Interconnect Technology Corp's Accrued Liabilities?
Accrued Liabilities
3.6B TWD

Based on the financial report for Jun 30, 2024, Kinsus Interconnect Technology Corp's Accrued Liabilities amounts to 3.6B TWD.

What is Kinsus Interconnect Technology Corp's Accrued Liabilities growth rate?
Accrued Liabilities CAGR 5Y
6%

Over the last year, the Accrued Liabilities growth was -21%. The average annual Accrued Liabilities growth rates for Kinsus Interconnect Technology Corp have been 3% over the past three years , 6% over the past five years .

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