Winbond Electronics Corp
TWSE:2344

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Winbond Electronics Corp
TWSE:2344
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Price: 15.55 TWD -4.6% Market Closed
Market Cap: 70B TWD

Winbond Electronics Corp
Investor Relations

Founded in the vibrant tech landscape of Taiwan, Winbond Electronics Corp. has carved out a notable niche as a prominent player in the semiconductor industry. Born in 1987, the company has grown into a powerhouse known for its commitment to producing high-quality memory solutions. Specializing in DRAM (Dynamic Random Access Memory) and NOR Flash memory, Winbond creates essential components that are fundamental to a plethora of digital devices. Their products power everything from industrial tools and consumer electronics to cutting-edge automotive systems, making the company a crucial cog in the wheel of global digital innovation. By nurturing a robust research and development program, Winbond continuously refines its technology to enhance performance and energy efficiency, ensuring that it remains on the cutting edge of the memory market.

Winbond’s business model admirably balances manufacturing prowess with strategic market positioning. Its revenue streams are fueled by a broad portfolio of semiconductor memory products, catering to a diverse clientele across various sectors. By maintaining control over its own manufacturing facilities, Winbond ensures a high level of quality control and production efficiency, which are critical in managing the cyclical nature of the semiconductor industry. Furthermore, Winbond's commitment to customer-centric solutions strengthens its competitive edge, as the company adeptly responds to evolving market demands. This strategic approach not only sustains its profitability but also reinforces its reputation as a reliable supplier in the global memory market, underscoring Winbond's role as an integral part of the digital ecosystem.

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2344
Taiwan Weighted Index

Earnings Calls

No Earnings Calls Available

Management

Mr. Yu-Cheng Chiao
Chairman & CEO
No Bio Available
Mr. Pei-Ming Chen MSEE
President & CTO
No Bio Available
Mr. Chih-Chung Chou
CFO, Head of Finance Division & Corporate Governance Officer
No Bio Available
Ms. Chin-Feng Yang
Head of Accounting Division & Company Secretary
No Bio Available
Ms. Yung Chin
Chief Administrative Officer & Director
No Bio Available
Mr. Eungjoon Park
Chief Strategy Officer
No Bio Available
Dr. Pei-Lin Pai Ph.D.
CTO of Advanced Technology Development Group
No Bio Available
Shui-Pao Wu
Chief Information Security Officer
No Bio Available
Dr. Keh-Shew Lu Ph.D.
Advisior
No Bio Available

Contacts

Address
TAICHUNG
TAICHUNG
No.8, Keya 1st Road, Central Science Industrial Park, Daya District
Contacts
+886425218168
www.winbond.com