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Winbond Electronics Corp
TWSE:2344

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Winbond Electronics Corp
TWSE:2344
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Price: 122.5 TWD 3.81% Market Closed
Market Cap: NT$551.3B

Winbond Electronics Corp
Total Current Liabilities

Last Value
3 Years 3Y CAGR
5 Years 5Y CAGR
10 Years 10Y CAGR
Last Value
3 Years 3Y CAGR
5 Years 5Y CAGR
10 Years 10Y CAGR
Quarterly
Annual
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Winbond Electronics Corp
Total Current Liabilities Peer Comparison

Competitors Analysis
Latest Figures & CAGR of Competitors

Company Total Current Liabilities CAGR 3Y CAGR 5Y CAGR 10Y
Winbond Electronics Corp
TWSE:2344
Total Current Liabilities
NT$51B
CAGR 3-Years
18%
CAGR 5-Years
16%
CAGR 10-Years
15%
ASE Technology Holding Co Ltd
TWSE:3711
Total Current Liabilities
NT$259.6B
CAGR 3-Years
5%
CAGR 5-Years
9%
CAGR 10-Years
N/A
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
Total Current Liabilities
NT$1.5T
CAGR 3-Years
16%
CAGR 5-Years
19%
CAGR 10-Years
21%
United Microelectronics Corp
TWSE:2303
Total Current Liabilities
NT$82.3B
CAGR 3-Years
-9%
CAGR 5-Years
1%
CAGR 10-Years
5%
MediaTek Inc
TWSE:2454
Total Current Liabilities
NT$231.5B
CAGR 3-Years
7%
CAGR 5-Years
11%
CAGR 10-Years
8%
Nanya Technology Corp
TWSE:2408
Total Current Liabilities
NT$19.7B
CAGR 3-Years
10%
CAGR 5-Years
13%
CAGR 10-Years
-7%
No Stocks Found

Winbond Electronics Corp
Glance View

Market Cap
551.3B TWD
Industry
Semiconductors

Founded in the vibrant tech landscape of Taiwan, Winbond Electronics Corp. has carved out a notable niche as a prominent player in the semiconductor industry. Born in 1987, the company has grown into a powerhouse known for its commitment to producing high-quality memory solutions. Specializing in DRAM (Dynamic Random Access Memory) and NOR Flash memory, Winbond creates essential components that are fundamental to a plethora of digital devices. Their products power everything from industrial tools and consumer electronics to cutting-edge automotive systems, making the company a crucial cog in the wheel of global digital innovation. By nurturing a robust research and development program, Winbond continuously refines its technology to enhance performance and energy efficiency, ensuring that it remains on the cutting edge of the memory market. Winbond’s business model admirably balances manufacturing prowess with strategic market positioning. Its revenue streams are fueled by a broad portfolio of semiconductor memory products, catering to a diverse clientele across various sectors. By maintaining control over its own manufacturing facilities, Winbond ensures a high level of quality control and production efficiency, which are critical in managing the cyclical nature of the semiconductor industry. Furthermore, Winbond's commitment to customer-centric solutions strengthens its competitive edge, as the company adeptly responds to evolving market demands. This strategic approach not only sustains its profitability but also reinforces its reputation as a reliable supplier in the global memory market, underscoring Winbond's role as an integral part of the digital ecosystem.

Intrinsic Value
90.85 TWD
Overvaluation 26%
Intrinsic Value
Price

See Also

What is Winbond Electronics Corp's Total Current Liabilities?
Total Current Liabilities
51B TWD

Based on the financial report for Sep 30, 2025, Winbond Electronics Corp's Total Current Liabilities amounts to 51B TWD.

What is Winbond Electronics Corp's Total Current Liabilities growth rate?
Total Current Liabilities CAGR 10Y
15%

Over the last year, the Total Current Liabilities growth was 20%. The average annual Total Current Liabilities growth rates for Winbond Electronics Corp have been 18% over the past three years , 16% over the past five years , and 15% over the past ten years .

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