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Tianshui Huatian Technology Co Ltd
SZSE:002185

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Tianshui Huatian Technology Co Ltd
SZSE:002185
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Price: 9.53 CNY 2.58% Market Closed
Market Cap: 30.5B CNY

Tianshui Huatian Technology Co Ltd's latest stock split occurred on Jun 20, 2017

The company executed a 20-for-10 stock split, meaning that for every 10 shares held, investors received 20 new shares.

Before the split, Tianshui Huatian Technology Co Ltd traded at 12.7867 per share. Afterward, the share price was about 6.3099.

The adjusted shares began trading on Jun 20, 2017. This was Tianshui Huatian Technology Co Ltd's 6th stock split, following the previous one in Jun 17, 2016.

Last Splits:
Jun 20, 2017
20-for-10
Jun 17, 2016
13-for-10
Jul 12, 2012
16-for-10
May 18, 2010
1-for-1
May 25, 2009
11-for-10
Pre-Split Price
6.2791 12.7867
Post-Split Price
6.3099
Before
After
Last Splits:
Jun 20, 2017
20-for-10
Jun 17, 2016
13-for-10
Jul 12, 2012
16-for-10
May 18, 2010
1-for-1
May 25, 2009
11-for-10

Tianshui Huatian Technology Co Ltd
Stock Splits History

Tianshui Huatian Technology Co Ltd Stock Splits Timeline
Jun 20, 2017
Jun 20, 2017
Split 20-for-10
x2
Pre-Split Price
6.2791 12.7867
Post-Split Price
6.3099
Before
After
Jun 17, 2016
Jun 17, 2016
Split 13-for-10
x1.3
Pre-Split Price
5.1138 13.5914
Post-Split Price
5.0935
Before
After
Jul 12, 2012
Jul 12, 2012
Split 16-for-10
x1.6
Pre-Split Price
1.7181 7.4932
Post-Split Price
1.7264
Before
After
May 18, 2010
May 18, 2010
Split 1-for-1
/1
Pre-Split Price
N/A
Post-Split Price
1.7612
Before
After
May 25, 2009
May 25, 2009
Split 11-for-10
x1.1
Pre-Split Price
N/A
Post-Split Price
1.7612
Before
After
May 16, 2008
May 16, 2008
Split 1-for-1
/1
Pre-Split Price
N/A
Post-Split Price
1.7612
Before
After

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Tianshui Huatian Technology Co Ltd
Glance View

Market Cap
30.5B CNY
Industry
Semiconductors

Tianshui Huatian Technology Co., Ltd., a key player in the semiconductor industry, operates in a domain where precision and cutting-edge technology converge. Established in the rugged landscape of northwest China, the company has carved its niche by primarily focusing on semiconductor assembly and testing, crucial processes in the chip manufacturing ecosystem. These stages involve intricate methodologies to ensure that each semiconductor device is packaged securely and tested comprehensively to meet rigorous performance standards. By offering packaging solutions like flip-chip and wire bonding, Tianshui Huatian transforms delicate semiconductor dies into robust components ready for integration into various electronic devices. This meticulous packaging not only safeguards the microchips but also enhances their performance attributes, a critical factor for technologies ranging from consumer electronics to industrial applications. Revenue flows into Tianshui Huatian’s coffers through its strategic collaborations with major semiconductor design companies around the globe, serving as a crucial outsourcing partner in the supply chain. By capitalizing on long-standing relationships and continuous technological advancements, the company garners trust and loyalty from its partners, who rely on its expertise to bring high-performance semiconductor solutions to market swiftly and cost-effectively. Furthermore, as semiconductor demand continues to surge with the advent of 5G technology, IoT devices, and AI innovations, Tianshui Huatian remains at the forefront of this expansive tide, poised for sustained growth in an ever-evolving tech landscape. This positioning underscores its critical role in linking the raw ingenuity of semiconductor designs with the practical needs of manufacturing, making Tianshui Huatian a pillar in the world’s technological framework.

Intrinsic Value
8.63 CNY
Overvaluation 9%
Intrinsic Value
Price
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