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Tianshui Huatian Technology Co Ltd
SZSE:002185

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Tianshui Huatian Technology Co Ltd
SZSE:002185
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Price: 11.96 CNY -1.97% Market Closed
Market Cap: 38.3B CNY
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Tianshui Huatian Technology Co Ltd
Net Issuance of Debt

Last Value
3-Years 3-Y CAGR
5-Years 5-Y CAGR
10-Years 10-Y CAGR
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Tianshui Huatian Technology Co Ltd
Net Issuance of Debt Peer Comparison

Competitors Analysis
Latest Figures & CAGR of Competitors

Company Net Issuance of Debt CAGR 3Y CAGR 5Y CAGR 10Y
T
Tianshui Huatian Technology Co Ltd
SZSE:002185
Net Issuance of Debt
ÂĄ3.7B
CAGR 3-Years
5%
CAGR 5-Years
28%
CAGR 10-Years
24%
Semiconductor Manufacturing International Corp
HKEX:981
Net Issuance of Debt
$1.1B
CAGR 3-Years
-17%
CAGR 5-Years
25%
CAGR 10-Years
N/A
Cambricon Technologies Corp Ltd
SSE:688256
Net Issuance of Debt
N/A
CAGR 3-Years
N/A
CAGR 5-Years
N/A
CAGR 10-Years
N/A
LONGi Green Energy Technology Co Ltd
SSE:601012
Net Issuance of Debt
ÂĄ10.1B
CAGR 3-Years
49%
CAGR 5-Years
55%
CAGR 10-Years
42%
Will Semiconductor Co Ltd Shanghai
SSE:603501
Net Issuance of Debt
-ÂĄ2.5B
CAGR 3-Years
N/A
CAGR 5-Years
N/A
CAGR 10-Years
N/A
H
Hygon Information Technology Co Ltd
SSE:688041
Net Issuance of Debt
ÂĄ185.5m
CAGR 3-Years
-12%
CAGR 5-Years
N/A
CAGR 10-Years
N/A
No Stocks Found

Tianshui Huatian Technology Co Ltd
Glance View

Market Cap
38.3B CNY
Industry
Semiconductors

Tianshui Huatian Technology Co., Ltd., a key player in the semiconductor industry, operates in a domain where precision and cutting-edge technology converge. Established in the rugged landscape of northwest China, the company has carved its niche by primarily focusing on semiconductor assembly and testing, crucial processes in the chip manufacturing ecosystem. These stages involve intricate methodologies to ensure that each semiconductor device is packaged securely and tested comprehensively to meet rigorous performance standards. By offering packaging solutions like flip-chip and wire bonding, Tianshui Huatian transforms delicate semiconductor dies into robust components ready for integration into various electronic devices. This meticulous packaging not only safeguards the microchips but also enhances their performance attributes, a critical factor for technologies ranging from consumer electronics to industrial applications. Revenue flows into Tianshui Huatian’s coffers through its strategic collaborations with major semiconductor design companies around the globe, serving as a crucial outsourcing partner in the supply chain. By capitalizing on long-standing relationships and continuous technological advancements, the company garners trust and loyalty from its partners, who rely on its expertise to bring high-performance semiconductor solutions to market swiftly and cost-effectively. Furthermore, as semiconductor demand continues to surge with the advent of 5G technology, IoT devices, and AI innovations, Tianshui Huatian remains at the forefront of this expansive tide, poised for sustained growth in an ever-evolving tech landscape. This positioning underscores its critical role in linking the raw ingenuity of semiconductor designs with the practical needs of manufacturing, making Tianshui Huatian a pillar in the world’s technological framework.

Intrinsic Value
11.99 CNY
Fairly Valued
Intrinsic Value
Price
T

See Also

What is Tianshui Huatian Technology Co Ltd's Net Issuance of Debt?
Net Issuance of Debt
3.7B CNY

Based on the financial report for Sep 30, 2024, Tianshui Huatian Technology Co Ltd's Net Issuance of Debt amounts to 3.7B CNY.

What is Tianshui Huatian Technology Co Ltd's Net Issuance of Debt growth rate?
Net Issuance of Debt CAGR 10Y
24%

Over the last year, the Net Issuance of Debt growth was 70%. The average annual Net Issuance of Debt growth rates for Tianshui Huatian Technology Co Ltd have been 5% over the past three years , 28% over the past five years , and 24% over the past ten years .

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