Tianshui Huatian Technology Co Ltd
SZSE:002185
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Tianshui Huatian Technology Co Ltd
Net Issuance of Common Stock
Tianshui Huatian Technology Co Ltd
Net Issuance of Common Stock Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Net Issuance of Common Stock | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
T
|
Tianshui Huatian Technology Co Ltd
SZSE:002185
|
Net Issuance of Common Stock
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
Semiconductor Manufacturing International Corp
HKEX:981
|
Net Issuance of Common Stock
$50.7m
|
CAGR 3-Years
-81%
|
CAGR 5-Years
-5%
|
CAGR 10-Years
-13%
|
|
|
Cambricon Technologies Corp Ltd
SSE:688256
|
Net Issuance of Common Stock
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
LONGi Green Energy Technology Co Ltd
SSE:601012
|
Net Issuance of Common Stock
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
Will Semiconductor Co Ltd Shanghai
SSE:603501
|
Net Issuance of Common Stock
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
H
|
Hygon Information Technology Co Ltd
SSE:688041
|
Net Issuance of Common Stock
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
Tianshui Huatian Technology Co Ltd
Glance View
Tianshui Huatian Technology Co., Ltd. engages in the provision of semiconductor integrated circuits testing and packaging services. The company is headquartered in Tianshui, Gansu and currently employs 29,599 full-time employees. The company went IPO on 2007-11-20. The firm's IC packaging and testing products consist of dual in-line package (DIP) series, small out-line package (SOP) series, shrink small out-line package (SSOP) series, quad flat package (QFP) series and small out-line transistor (SOT) series products, among others. The firm also provides light-emitting diode (LED) products. The firm distributes its products within domestic market and to overseas markets.
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