Tianshui Huatian Technology Co Ltd
SZSE:002185
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Tianshui Huatian Technology Co Ltd
Accounts Payable
Tianshui Huatian Technology Co Ltd
Accounts Payable Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
Company | Accounts Payable | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
---|---|---|---|---|---|---|
T
|
Tianshui Huatian Technology Co Ltd
SZSE:002185
|
Accounts Payable
ÂĄ2.8B
|
CAGR 3-Years
-9%
|
CAGR 5-Years
11%
|
CAGR 10-Years
17%
|
|
Semiconductor Manufacturing International Corp
HKEX:981
|
Accounts Payable
$3.4B
|
CAGR 3-Years
30%
|
CAGR 5-Years
29%
|
CAGR 10-Years
20%
|
||
Cambricon Technologies Corp Ltd
SSE:688256
|
Accounts Payable
ÂĄ237.2m
|
CAGR 3-Years
0%
|
CAGR 5-Years
60%
|
CAGR 10-Years
N/A
|
||
LONGi Green Energy Technology Co Ltd
SSE:601012
|
Accounts Payable
ÂĄ15.7B
|
CAGR 3-Years
11%
|
CAGR 5-Years
32%
|
CAGR 10-Years
40%
|
||
Will Semiconductor Co Ltd Shanghai
SSE:603501
|
Accounts Payable
ÂĄ2.1B
|
CAGR 3-Years
-6%
|
CAGR 5-Years
5%
|
CAGR 10-Years
N/A
|
||
H
|
Hygon Information Technology Co Ltd
SSE:688041
|
Accounts Payable
ÂĄ321.8m
|
CAGR 3-Years
13%
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
Tianshui Huatian Technology Co Ltd
Glance View
Tianshui Huatian Technology Co., Ltd., a key player in the semiconductor industry, operates in a domain where precision and cutting-edge technology converge. Established in the rugged landscape of northwest China, the company has carved its niche by primarily focusing on semiconductor assembly and testing, crucial processes in the chip manufacturing ecosystem. These stages involve intricate methodologies to ensure that each semiconductor device is packaged securely and tested comprehensively to meet rigorous performance standards. By offering packaging solutions like flip-chip and wire bonding, Tianshui Huatian transforms delicate semiconductor dies into robust components ready for integration into various electronic devices. This meticulous packaging not only safeguards the microchips but also enhances their performance attributes, a critical factor for technologies ranging from consumer electronics to industrial applications. Revenue flows into Tianshui Huatian’s coffers through its strategic collaborations with major semiconductor design companies around the globe, serving as a crucial outsourcing partner in the supply chain. By capitalizing on long-standing relationships and continuous technological advancements, the company garners trust and loyalty from its partners, who rely on its expertise to bring high-performance semiconductor solutions to market swiftly and cost-effectively. Furthermore, as semiconductor demand continues to surge with the advent of 5G technology, IoT devices, and AI innovations, Tianshui Huatian remains at the forefront of this expansive tide, poised for sustained growth in an ever-evolving tech landscape. This positioning underscores its critical role in linking the raw ingenuity of semiconductor designs with the practical needs of manufacturing, making Tianshui Huatian a pillar in the world’s technological framework.
See Also
What is Tianshui Huatian Technology Co Ltd's Accounts Payable?
Accounts Payable
2.8B
CNY
Based on the financial report for Sep 30, 2024, Tianshui Huatian Technology Co Ltd's Accounts Payable amounts to 2.8B CNY.
What is Tianshui Huatian Technology Co Ltd's Accounts Payable growth rate?
Accounts Payable CAGR 10Y
17%
Over the last year, the Accounts Payable growth was 21%. The average annual Accounts Payable growth rates for Tianshui Huatian Technology Co Ltd have been -9% over the past three years , 11% over the past five years , and 17% over the past ten years .