TongFu Microelectronics Co Ltd
SZSE:002156
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TongFu Microelectronics Co Ltd
Additional Paid In Capital
TongFu Microelectronics Co Ltd
Additional Paid In Capital Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Additional Paid In Capital | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
T
|
TongFu Microelectronics Co Ltd
SZSE:002156
|
Additional Paid In Capital
¥9.5B
|
CAGR 3-Years
11%
|
CAGR 5-Years
20%
|
CAGR 10-Years
24%
|
|
|
Semiconductor Manufacturing International Corp
HKEX:981
|
Additional Paid In Capital
$14.3B
|
CAGR 3-Years
1%
|
CAGR 5-Years
23%
|
CAGR 10-Years
13%
|
|
|
Cambricon Technologies Corp Ltd
SSE:688256
|
Additional Paid In Capital
¥9.6B
|
CAGR 3-Years
9%
|
CAGR 5-Years
59%
|
CAGR 10-Years
N/A
|
|
|
LONGi Green Energy Technology Co Ltd
SSE:601012
|
Additional Paid In Capital
¥13B
|
CAGR 3-Years
-2%
|
CAGR 5-Years
4%
|
CAGR 10-Years
24%
|
|
|
Will Semiconductor Co Ltd Shanghai
SSE:603501
|
Additional Paid In Capital
¥11.5B
|
CAGR 3-Years
16%
|
CAGR 5-Years
12%
|
CAGR 10-Years
N/A
|
|
|
H
|
Hygon Information Technology Co Ltd
SSE:688041
|
Additional Paid In Capital
¥14.4B
|
CAGR 3-Years
68%
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
TongFu Microelectronics Co Ltd
Glance View
In the bustling heart of China's semiconductor landscape, TongFu Microelectronics Co. Ltd. stands as a testament to the nation's drive towards technological excellence. Founded in 1997, TongFu emerged as a vital player amid the rapid growth of the global electronics market, focusing its expertise on providing comprehensive assembly and testing services. The company is deeply entrenched in the integrated circuit (IC) sector, offering solutions that include IC packaging, testing, and related services. By adhering to meticulous quality standards and leveraging sophisticated technology, TongFu has forged partnerships with leading chip manufacturers worldwide, enabling it to serve a diverse range of sectors from consumer electronics to high-demand telecommunications industries. The robust financial performance of TongFu Microelectronics is intricately linked to its strategic positioning within the semiconductor supply chain. Despite the volatile nature of this market, markable by cyclical highs and lows driven by technological advancements and fluctuating demand, TongFu turns its expertise into a steady revenue stream. By specializing in outsourced semiconductor assembly and test (OSAT), TongFu capitalizes on the growing trend of semiconductor design companies outsourcing these operations. This approach not only optimizes the company's resource utilization and broadens its client base but also ensures a steady workflow that translates into consistent revenue, positioning TongFu as an indispensable cog in the complex machinery of global technology manufacturing.
See Also
What is TongFu Microelectronics Co Ltd's Additional Paid In Capital?
Additional Paid In Capital
9.5B
CNY
Based on the financial report for Sep 30, 2024, TongFu Microelectronics Co Ltd's Additional Paid In Capital amounts to 9.5B CNY.
What is TongFu Microelectronics Co Ltd's Additional Paid In Capital growth rate?
Additional Paid In Capital CAGR 10Y
24%
Over the last year, the Additional Paid In Capital growth was 0%. The average annual Additional Paid In Capital growth rates for TongFu Microelectronics Co Ltd have been 11% over the past three years , 20% over the past five years , and 24% over the past ten years .
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