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TongFu Microelectronics Co Ltd
SZSE:002156

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TongFu Microelectronics Co Ltd
SZSE:002156
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Price: 26.19 CNY -4.62% Market Closed
Market Cap: 39.7B CNY
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TongFu Microelectronics Co Ltd
Accrued Liabilities

Last Value
3-Years 3-Y CAGR
5-Years 5-Y CAGR
10-Years 10-Y CAGR
Quarterly
Annual
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TongFu Microelectronics Co Ltd
Accrued Liabilities Peer Comparison

Competitors Analysis
Latest Figures & CAGR of Competitors

Company Accrued Liabilities CAGR 3Y CAGR 5Y CAGR 10Y
T
TongFu Microelectronics Co Ltd
SZSE:002156
Accrued Liabilities
ÂĄ209.6m
CAGR 3-Years
17%
CAGR 5-Years
37%
CAGR 10-Years
26%
Semiconductor Manufacturing International Corp
HKEX:981
Accrued Liabilities
$353.6m
CAGR 3-Years
20%
CAGR 5-Years
19%
CAGR 10-Years
12%
Cambricon Technologies Corp Ltd
SSE:688256
Accrued Liabilities
ÂĄ161.1m
CAGR 3-Years
5%
CAGR 5-Years
33%
CAGR 10-Years
N/A
LONGi Green Energy Technology Co Ltd
SSE:601012
Accrued Liabilities
ÂĄ1.3B
CAGR 3-Years
10%
CAGR 5-Years
24%
CAGR 10-Years
41%
Will Semiconductor Co Ltd Shanghai
SSE:603501
Accrued Liabilities
ÂĄ246.8m
CAGR 3-Years
N/A
CAGR 5-Years
10%
CAGR 10-Years
N/A
H
Hygon Information Technology Co Ltd
SSE:688041
Accrued Liabilities
ÂĄ648.6m
CAGR 3-Years
39%
CAGR 5-Years
N/A
CAGR 10-Years
N/A
No Stocks Found

TongFu Microelectronics Co Ltd
Glance View

Market Cap
39.7B CNY
Industry
Semiconductors

In the bustling heart of China's semiconductor landscape, TongFu Microelectronics Co. Ltd. stands as a testament to the nation's drive towards technological excellence. Founded in 1997, TongFu emerged as a vital player amid the rapid growth of the global electronics market, focusing its expertise on providing comprehensive assembly and testing services. The company is deeply entrenched in the integrated circuit (IC) sector, offering solutions that include IC packaging, testing, and related services. By adhering to meticulous quality standards and leveraging sophisticated technology, TongFu has forged partnerships with leading chip manufacturers worldwide, enabling it to serve a diverse range of sectors from consumer electronics to high-demand telecommunications industries. The robust financial performance of TongFu Microelectronics is intricately linked to its strategic positioning within the semiconductor supply chain. Despite the volatile nature of this market, markable by cyclical highs and lows driven by technological advancements and fluctuating demand, TongFu turns its expertise into a steady revenue stream. By specializing in outsourced semiconductor assembly and test (OSAT), TongFu capitalizes on the growing trend of semiconductor design companies outsourcing these operations. This approach not only optimizes the company's resource utilization and broadens its client base but also ensures a steady workflow that translates into consistent revenue, positioning TongFu as an indispensable cog in the complex machinery of global technology manufacturing.

Intrinsic Value
42.94 CNY
Undervaluation 39%
Intrinsic Value
Price
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See Also

What is TongFu Microelectronics Co Ltd's Accrued Liabilities?
Accrued Liabilities
209.6m CNY

Based on the financial report for Sep 30, 2024, TongFu Microelectronics Co Ltd's Accrued Liabilities amounts to 209.6m CNY.

What is TongFu Microelectronics Co Ltd's Accrued Liabilities growth rate?
Accrued Liabilities CAGR 10Y
26%

Over the last year, the Accrued Liabilities growth was 44%. The average annual Accrued Liabilities growth rates for TongFu Microelectronics Co Ltd have been 17% over the past three years , 37% over the past five years , and 26% over the past ten years .

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