China Wafer Level CSP Co Ltd
SSE:603005
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China Wafer Level CSP Co Ltd
China Wafer Level CSP Co Ltd
Net Issuance of Debt
China Wafer Level CSP Co Ltd
Net Issuance of Debt Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Net Issuance of Debt | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
|
China Wafer Level CSP Co Ltd
SSE:603005
|
Net Issuance of Debt
-¥326.2m
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
-33%
|
|
|
Semiconductor Manufacturing International Corp
HKEX:981
|
Net Issuance of Debt
$1.1B
|
CAGR 3-Years
-13%
|
CAGR 5-Years
14%
|
CAGR 10-Years
30%
|
|
|
Cambricon Technologies Corp Ltd
SSE:688256
|
Net Issuance of Debt
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
LONGi Green Energy Technology Co Ltd
SSE:601012
|
Net Issuance of Debt
¥10.1B
|
CAGR 3-Years
49%
|
CAGR 5-Years
55%
|
CAGR 10-Years
42%
|
|
|
Will Semiconductor Co Ltd Shanghai
SSE:603501
|
Net Issuance of Debt
-¥3.8B
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
H
|
Hygon Information Technology Co Ltd
SSE:688041
|
Net Issuance of Debt
¥185.5m
|
CAGR 3-Years
-12%
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
China Wafer Level CSP Co Ltd
Glance View
China Wafer Level CSP Co., Ltd. engages in the manufacture of semiconductor CMOS image sensor chips. The company is headquartered in Suzhou, Jiangsu and currently employs 1,125 full-time employees. The company went IPO on 2014-02-10. The main products of the Company include image sensor chips, environment light sensor chips, biometric identification chips, microelectromechanical systems (MEMS), environment light induced chips, medical electronics and radio frequency chips, among others. The Company’s products are applied in various areas, such as consumer electronics, including mobile phones, computers, cameras and game consoles; security monitoring; identification; automotive electronics; virtual reality; smart cards and medical electronics. The firm distributes its products primarily in overseas markets.
See Also
What is China Wafer Level CSP Co Ltd's Net Issuance of Debt?
Net Issuance of Debt
-326.2m
CNY
Based on the financial report for Jun 30, 2024, China Wafer Level CSP Co Ltd's Net Issuance of Debt amounts to -326.2m CNY.
What is China Wafer Level CSP Co Ltd's Net Issuance of Debt growth rate?
Net Issuance of Debt CAGR 10Y
-33%
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