China Wafer Level CSP Co Ltd
SSE:603005
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China Wafer Level CSP Co Ltd
Short-Term Debt
China Wafer Level CSP Co Ltd
Short-Term Debt Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
Company | Short-Term Debt | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
---|---|---|---|---|---|---|
China Wafer Level CSP Co Ltd
SSE:603005
|
Short-Term Debt
ÂĄ38.7m
|
CAGR 3-Years
51%
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
||
Semiconductor Manufacturing International Corp
HKEX:981
|
Short-Term Debt
$0
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
||
Cambricon Technologies Corp Ltd
SSE:688256
|
Short-Term Debt
ÂĄ0
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
||
LONGi Green Energy Technology Co Ltd
SSE:601012
|
Short-Term Debt
ÂĄ21.3B
|
CAGR 3-Years
5%
|
CAGR 5-Years
17%
|
CAGR 10-Years
42%
|
||
Will Semiconductor Co Ltd Shanghai
SSE:603501
|
Short-Term Debt
ÂĄ1.8B
|
CAGR 3-Years
-13%
|
CAGR 5-Years
-8%
|
CAGR 10-Years
N/A
|
||
H
|
Hygon Information Technology Co Ltd
SSE:688041
|
Short-Term Debt
ÂĄ350m
|
CAGR 3-Years
36%
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
China Wafer Level CSP Co Ltd
Glance View
China Wafer Level CSP Co., Ltd. engages in the manufacture of semiconductor CMOS image sensor chips. The company is headquartered in Suzhou, Jiangsu and currently employs 1,125 full-time employees. The company went IPO on 2014-02-10. The main products of the Company include image sensor chips, environment light sensor chips, biometric identification chips, microelectromechanical systems (MEMS), environment light induced chips, medical electronics and radio frequency chips, among others. The Company’s products are applied in various areas, such as consumer electronics, including mobile phones, computers, cameras and game consoles; security monitoring; identification; automotive electronics; virtual reality; smart cards and medical electronics. The firm distributes its products primarily in overseas markets.
See Also
What is China Wafer Level CSP Co Ltd's Short-Term Debt?
Short-Term Debt
38.7m
CNY
Based on the financial report for Jun 30, 2024, China Wafer Level CSP Co Ltd's Short-Term Debt amounts to 38.7m CNY.
What is China Wafer Level CSP Co Ltd's Short-Term Debt growth rate?
Short-Term Debt CAGR 3Y
51%
Over the last year, the Short-Term Debt growth was 188%. The average annual Short-Term Debt growth rates for China Wafer Level CSP Co Ltd have been 51% over the past three years .