China Wafer Level CSP Co Ltd
SSE:603005
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China Wafer Level CSP Co Ltd
China Wafer Level CSP Co Ltd
Additional Paid In Capital
China Wafer Level CSP Co Ltd
Additional Paid In Capital Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Additional Paid In Capital | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
|
China Wafer Level CSP Co Ltd
SSE:603005
|
Additional Paid In Capital
¥1.7B
|
CAGR 3-Years
-3%
|
CAGR 5-Years
12%
|
CAGR 10-Years
8%
|
|
|
Semiconductor Manufacturing International Corp
HKEX:981
|
Additional Paid In Capital
$14.1B
|
CAGR 3-Years
1%
|
CAGR 5-Years
23%
|
CAGR 10-Years
13%
|
|
|
Cambricon Technologies Corp Ltd
SSE:688256
|
Additional Paid In Capital
¥9.6B
|
CAGR 3-Years
9%
|
CAGR 5-Years
59%
|
CAGR 10-Years
N/A
|
|
|
LONGi Green Energy Technology Co Ltd
SSE:601012
|
Additional Paid In Capital
¥13B
|
CAGR 3-Years
-2%
|
CAGR 5-Years
11%
|
CAGR 10-Years
24%
|
|
|
Will Semiconductor Co Ltd Shanghai
SSE:603501
|
Additional Paid In Capital
¥11.5B
|
CAGR 3-Years
17%
|
CAGR 5-Years
56%
|
CAGR 10-Years
N/A
|
|
|
H
|
Hygon Information Technology Co Ltd
SSE:688041
|
Additional Paid In Capital
¥14.4B
|
CAGR 3-Years
68%
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
China Wafer Level CSP Co Ltd
Glance View
China Wafer Level CSP Co., Ltd. engages in the manufacture of semiconductor CMOS image sensor chips. The company is headquartered in Suzhou, Jiangsu and currently employs 1,125 full-time employees. The company went IPO on 2014-02-10. The main products of the Company include image sensor chips, environment light sensor chips, biometric identification chips, microelectromechanical systems (MEMS), environment light induced chips, medical electronics and radio frequency chips, among others. The Company’s products are applied in various areas, such as consumer electronics, including mobile phones, computers, cameras and game consoles; security monitoring; identification; automotive electronics; virtual reality; smart cards and medical electronics. The firm distributes its products primarily in overseas markets.
See Also
What is China Wafer Level CSP Co Ltd's Additional Paid In Capital?
Additional Paid In Capital
1.7B
CNY
Based on the financial report for Jun 30, 2024, China Wafer Level CSP Co Ltd's Additional Paid In Capital amounts to 1.7B CNY.
What is China Wafer Level CSP Co Ltd's Additional Paid In Capital growth rate?
Additional Paid In Capital CAGR 10Y
8%
Over the last year, the Additional Paid In Capital growth was -1%. The average annual Additional Paid In Capital growth rates for China Wafer Level CSP Co Ltd have been -3% over the past three years , 12% over the past five years , and 8% over the past ten years .
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