Rambus Inc
NASDAQ:RMBS
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Rambus Inc
Rambus Inc
Long-Term Debt
Rambus Inc
Long-Term Debt Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Long-Term Debt | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
|
Rambus Inc
NASDAQ:RMBS
|
Long-Term Debt
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
Qualcomm Inc
NASDAQ:QCOM
|
Long-Term Debt
$13.3B
|
CAGR 3-Years
-1%
|
CAGR 5-Years
0%
|
CAGR 10-Years
N/A
|
|
|
Texas Instruments Inc
NASDAQ:TXN
|
Long-Term Debt
$12.8B
|
CAGR 3-Years
21%
|
CAGR 5-Years
19%
|
CAGR 10-Years
13%
|
|
|
NVIDIA Corp
NASDAQ:NVDA
|
Long-Term Debt
$8.5B
|
CAGR 3-Years
-8%
|
CAGR 5-Years
34%
|
CAGR 10-Years
20%
|
|
|
Broadcom Inc
NASDAQ:AVGO
|
Long-Term Debt
$66.8B
|
CAGR 3-Years
18%
|
CAGR 5-Years
14%
|
CAGR 10-Years
28%
|
|
|
Advanced Micro Devices Inc
NASDAQ:AMD
|
Long-Term Debt
$1.7B
|
CAGR 3-Years
1 098%
|
CAGR 5-Years
15%
|
CAGR 10-Years
-2%
|
|
Rambus Inc
Glance View
Rambus, Inc. engages in the provision of cutting-edge semiconductor and Internet Protocol products, spanning memory and interfaces to security, smart sensors and lighting. The company is headquartered in San Jose, California and currently employs 690 full-time employees. The firm's memory subsystems provide chips and IP, which provide security in data-intensive systems. Its portfolio includes Double Data Rate 5 (DDR5), DDR4 and DDR3 memory interface chips. Its DDR memory interface chips for server memory modules enable increased bandwidth and expanded capacity in enterprise and cloud servers. The company sells memory interface chips directly and indirectly to memory module manufacturers and others. Its Silicon IP offers both interface and security IP solutions. Its interface IP solutions feature both memory and chip-to-chip interconnect technologies. Its portfolios of security IP solutions include crypto cores, hardware roots of trust, protocol engines and chip provisioning technologies. Its portfolio also includes physical interface (PHY) and digital controller IP to offer integrated memory and interconnect subsystems.
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