Aehr Test Systems
NASDAQ:AEHR
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Aehr Test Systems
Aehr Test Systems
Current Portion of Long-Term Debt
Aehr Test Systems
Current Portion of Long-Term Debt Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Current Portion of Long-Term Debt | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
|
Aehr Test Systems
NASDAQ:AEHR
|
Current Portion of Long-Term Debt
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
KLA Corp
NASDAQ:KLAC
|
Current Portion of Long-Term Debt
$750m
|
CAGR 3-Years
235%
|
CAGR 5-Years
25%
|
CAGR 10-Years
N/A
|
|
|
Applied Materials Inc
NASDAQ:AMAT
|
Current Portion of Long-Term Debt
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
Entegris Inc
NASDAQ:ENTG
|
Current Portion of Long-Term Debt
$65m
|
CAGR 3-Years
N/A
|
CAGR 5-Years
75%
|
CAGR 10-Years
29%
|
|
|
Lam Research Corp
NASDAQ:LRCX
|
Current Portion of Long-Term Debt
$504.7m
|
CAGR 3-Years
338%
|
CAGR 5-Years
-5%
|
CAGR 10-Years
0%
|
|
|
Teradyne Inc
NASDAQ:TER
|
Current Portion of Long-Term Debt
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
Aehr Test Systems
Glance View
Aehr Test Systems engages in the design, manufacture and marketing of test and burn-in products to the semiconductor manufacturing industry. The company is headquartered in Fremont, California and currently employs 79 full-time employees. The firm manufactures and markets full wafer contact test systems, test during burn-in systems, test fixtures and related accessories. The Company’s principal products are the Advanced Burn-In and Test System (ABTS), the FOX full wafer contact parallel test and burn-in systems, the MAX burn-in system, the WaferPak full wafer contactor, the DiePak carrier and test fixtures. The company develops, manufactures and sell systems, which are designed to perform reliability screening and stress testing, burn-in or cycling, of homogeneous and heterogenous logic and memory integrated circuits (ICs) sensors and optical devices. These systems can be used to simultaneously perform parallel testing and burn-in of packaged ICs, singulated bare die or ICs still in wafer form.
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