LB Semicon Co Ltd
KOSDAQ:061970
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EV/IC
Enterprise Value to Invested Capital (EV/IC) ratio compares a company`s total enterprise value to the capital invested in its business. It shows how efficiently the company`s market value reflects the funds used to generate returns.
Enterprise Value to Invested Capital (EV/IC) ratio compares a company`s total enterprise value to the capital invested in its business. It shows how efficiently the company`s market value reflects the funds used to generate returns.
Valuation Scenarios
If EV/IC returns to its 3-Year Average (0.7), the stock would be worth ₩4 802.34 (16% downside from current price).
| Scenario | EV/IC Value | Implied Price | Upside/Downside |
|---|---|---|---|
| Current Multiple | 0.9 | ₩5 730 |
0%
|
| 3-Year Average | 0.7 | ₩4 802.34 |
-16%
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| 5-Year Average | 0.8 | ₩5 067.97 |
-12%
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| Industry Average | 1.7 | ₩11 219.69 |
+96%
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| Country Average | 0.8 | ₩5 560.91 |
-3%
|
Forward EV/IC
Today’s price vs future invested capital
Peer Comparison
| Market Cap | EV/IC | P/E | ||||
|---|---|---|---|---|---|---|
| KR |
L
|
LB Semicon Co Ltd
KOSDAQ:061970
|
332.8B KRW | 0.9 | -2.2 | |
| US |
|
NVIDIA Corp
NASDAQ:NVDA
|
5.1T USD | 37.4 | 42.4 | |
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Broadcom Inc
NASDAQ:AVGO
|
1.9T USD | 12.8 | 76.9 | |
| TW |
|
Taiwan Semiconductor Manufacturing Co Ltd
TWSE:2330
|
57.4T TWD | 10.4 | 30 | |
| US |
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Micron Technology Inc
NASDAQ:MU
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584.8B USD | 7 | 24.3 | |
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Advanced Micro Devices Inc
NASDAQ:AMD
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549.5B USD | 8.5 | 126.8 | |
| KR |
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SK Hynix Inc
KRX:000660
|
701.7T KRW | 6.5 | 21.2 | |
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Intel Corp
NASDAQ:INTC
|
475.9B USD | 2.9 | -149.9 | |
| US |
|
Texas Instruments Inc
NASDAQ:TXN
|
244.2B USD | 8.7 | 45.8 | |
| UK |
|
Arm Holdings PLC
NASDAQ:ARM
|
214.2B USD | 32.2 | 267.4 | |
| US |
|
Analog Devices Inc
NASDAQ:ADI
|
190.1B USD | 4.5 | 70.2 |
Market Distribution
| Min | 0 |
| 30th Percentile | 0.5 |
| Median | 0.8 |
| 70th Percentile | 1.7 |
| Max | 2 224.6 |
Other Multiples
LB Semicon Co Ltd
Glance View
LB SEMICON Co., Ltd. engages in the provision of flip chip bumping services. The company is headquartered in Pyeongtaek, Gyeonggi-Do. The company went IPO on 2011-01-31. The firm provides bumping services, which are applied in back-end manufacturing processes of display driver ICs (DDIs), complementary metal-oxide-semiconductor (CMOS) image sensors (CISs) and others. In addition, the Company engages in the provision of semiconductor test and packaging services. The firm distributes its products within domestic market and to overseas markets.
