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Unisem (M) Bhd
Unrealized Security Profit/Loss
Unisem (M) Bhd
Unrealized Security Profit/Loss Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
Company | Unrealized Security Profit/Loss | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
---|---|---|---|---|---|---|
U
|
Unisem (M) Bhd
KLSE:UNISEM
|
Unrealized Security Profit/Loss
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
G
|
Globetronics Technology Bhd
KLSE:GTRONIC
|
Unrealized Security Profit/Loss
-myr310k
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
I
|
Inari Amertron Bhd
KLSE:INARI
|
Unrealized Security Profit/Loss
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
K
|
KESM Industries Bhd
KLSE:KESM
|
Unrealized Security Profit/Loss
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
M
|
Malaysian Pacific Industries Bhd
KLSE:MPI
|
Unrealized Security Profit/Loss
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
D
|
D & O Green Technologies Bhd
KLSE:D&O
|
Unrealized Security Profit/Loss
myr47.3m
|
CAGR 3-Years
27%
|
CAGR 5-Years
27%
|
CAGR 10-Years
47%
|
Unisem (M) Bhd
Glance View
Unisem (M) Bhd.engages in the manufacture of semiconductor devices. The company is headquartered in Ipoh, Perak. The firm is also a semiconductor assembly and test services provider. The firm offers an integrated suite of packaging and test services, such as wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits (IC) packaging, wafer level chipscale packaging (CSP) and radio frequency (RF), analog, digital and mixed-signal test services. Its services include design, assembly, test, failure analysis, and electrical and thermal characterization. The firm has over two semiconductor packaging and testing facilities and approximately two wafer bumping facilities in Ipoh, Perak, Malaysia and Chengdu, People’s Republic of China. Its subsidiaries include Unisem Advanced Technologies Sdn. Bhd., Unisem Chengdu Co., Ltd. and Unisem (Mauritius) Holdings Limited.