Unisem (M) Bhd
KLSE:UNISEM
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| 52 Week Range |
2.89
4.37
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Fubotv Inc
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Bank of America Corp
NYSE:BAC
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Palantir Technologies Inc
NYSE:PLTR
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C
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C3.ai Inc
NYSE:AI
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Uber Technologies Inc
NYSE:UBER
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NIO Inc
NYSE:NIO
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Fluor Corp
NYSE:FLR
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Jacobs Engineering Group Inc
NYSE:J
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TopBuild Corp
NYSE:BLD
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Abbott Laboratories
NYSE:ABT
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Chevron Corp
NYSE:CVX
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Occidental Petroleum Corp
NYSE:OXY
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Matrix Service Co
NASDAQ:MTRX
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Automatic Data Processing Inc
NASDAQ:ADP
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Qualcomm Inc
NASDAQ:QCOM
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Ambarella Inc
NASDAQ:AMBA
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Unisem (M) Bhd
Short-Term Investments
Unisem (M) Bhd
Short-Term Investments Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Short-Term Investments | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
U
|
Unisem (M) Bhd
KLSE:UNISEM
|
Short-Term Investments
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
G
|
Globetronics Technology Bhd
KLSE:GTRONIC
|
Short-Term Investments
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
I
|
Inari Amertron Bhd
KLSE:INARI
|
Short-Term Investments
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
K
|
KESM Industries Bhd
KLSE:KESM
|
Short-Term Investments
myr14.3m
|
CAGR 3-Years
0%
|
CAGR 5-Years
16%
|
CAGR 10-Years
6%
|
|
|
M
|
Malaysian Pacific Industries Bhd
KLSE:MPI
|
Short-Term Investments
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
D
|
D & O Green Technologies Bhd
KLSE:D&O
|
Short-Term Investments
myr50.3m
|
CAGR 3-Years
107%
|
CAGR 5-Years
53%
|
CAGR 10-Years
21%
|
|
Unisem (M) Bhd
Glance View
Unisem (M) Bhd.engages in the manufacture of semiconductor devices. The company is headquartered in Ipoh, Perak. The firm is also a semiconductor assembly and test services provider. The firm offers an integrated suite of packaging and test services, such as wafer bumping, wafer probing, wafer grinding, a range of leadframe and substrate integrated circuits (IC) packaging, wafer level chipscale packaging (CSP) and radio frequency (RF), analog, digital and mixed-signal test services. Its services include design, assembly, test, failure analysis, and electrical and thermal characterization. The firm has over two semiconductor packaging and testing facilities and approximately two wafer bumping facilities in Ipoh, Perak, Malaysia and Chengdu, People’s Republic of China. Its subsidiaries include Unisem Advanced Technologies Sdn. Bhd., Unisem Chengdu Co., Ltd. and Unisem (Mauritius) Holdings Limited.
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