Techbond Group Bhd
KLSE:TECHBND
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Techbond Group Bhd
Other Liabilities
Techbond Group Bhd
Other Liabilities Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Other Liabilities | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
T
|
Techbond Group Bhd
KLSE:TECHBND
|
Other Liabilities
myr168k
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
S
|
Sersol Bhd
KLSE:SERSOL
|
Other Liabilities
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
A
|
Artroniq Berhad
KLSE:ARTRONIQ
|
Other Liabilities
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
T
|
Toyo Ventures Holdings Bhd
KLSE:TOYOVEN
|
Other Liabilities
myr711.6m
|
CAGR 3-Years
33%
|
CAGR 5-Years
19%
|
CAGR 10-Years
N/A
|
|
Techbond Group Bhd
Glance View
Techbond Group Bhd.is an investment holding company, which engages in the provision of management services. The company is headquartered in Shah Alam, Selangor. The company went IPO on 2018-12-05. The firm is principally involved in developing, manufacturing and trading of industrial adhesives, sealants and providing supporting products and services. Its supporting products and services include certain original equipment manufacturer (OEM) industrial adhesives and sealants, chemicals, adhesive repellents and cleaners, spare parts and maintenance services. The firm operates through two segments. Industrial Adhesives & Sealants segment manufactures two types of industrial adhesives, water-based adhesives and hot melt adhesives. The raw materials used are mainly plastics and polymer-based materials. Supporting Products & Services segment provides supporting products and services. These include providing OEM’s industrial adhesives and sealants, supply of adhesive repellent and cleaner, and chemicals, as well as adhesive mixing machines.
See Also
What is Techbond Group Bhd's Other Liabilities?
Other Liabilities
168k
MYR
Based on the financial report for Sep 30, 2024, Techbond Group Bhd's Other Liabilities amounts to 168k MYR.
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