Inari Amertron Bhd
KLSE:INARI
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Inari Amertron Bhd
Capital Expenditures
Inari Amertron Bhd
Capital Expenditures Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Capital Expenditures | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
I
|
Inari Amertron Bhd
KLSE:INARI
|
Capital Expenditures
-myr180.7m
|
CAGR 3-Years
-22%
|
CAGR 5-Years
0%
|
CAGR 10-Years
-16%
|
|
|
U
|
Unisem (M) Bhd
KLSE:UNISEM
|
Capital Expenditures
-myr292m
|
CAGR 3-Years
4%
|
CAGR 5-Years
-3%
|
CAGR 10-Years
-18%
|
|
|
G
|
Globetronics Technology Bhd
KLSE:GTRONIC
|
Capital Expenditures
-myr18m
|
CAGR 3-Years
-20%
|
CAGR 5-Years
10%
|
CAGR 10-Years
-1%
|
|
|
K
|
KESM Industries Bhd
KLSE:KESM
|
Capital Expenditures
-myr15.4m
|
CAGR 3-Years
29%
|
CAGR 5-Years
10%
|
CAGR 10-Years
14%
|
|
|
M
|
Malaysian Pacific Industries Bhd
KLSE:MPI
|
Capital Expenditures
-myr227.1m
|
CAGR 3-Years
20%
|
CAGR 5-Years
-3%
|
CAGR 10-Years
-18%
|
|
|
D
|
D & O Green Technologies Bhd
KLSE:D&O
|
Capital Expenditures
-myr137.6m
|
CAGR 3-Years
-4%
|
CAGR 5-Years
-11%
|
CAGR 10-Years
-18%
|
|
Inari Amertron Bhd
Glance View
Inari Amertron Bhd.is an investment holding company, which engages in the provision of manufacturing services. The company is headquartered in Bayan Lepas, Pulau Pinang and currently employs 5,677 full-time employees. The company went IPO on 2011-07-19. The firm provides semiconductor assembly and test (OSAT) service for the semiconductor industry covering radio frequency, fiber-optics transceivers, optoelectronics, sensors, and custom integrated circuit (IC) technologies. Its activities include wafer processing, chip fabrication and wafer certification in fiber optic chips, system in package assembly and test, and other services. Its wafer processing includes probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection. Its system in package assembly and test includes surface mount technology, high speed and high accuracy flip-chip dice placement, in-line post vision, molding underfill (MUF) and post-mold oxide plating, and final testing. Its other services include sensor and IC package design and characterization.
See Also
What is Inari Amertron Bhd's Capital Expenditures?
Capital Expenditures
-180.7m
MYR
Based on the financial report for Jun 30, 2024, Inari Amertron Bhd's Capital Expenditures amounts to -180.7m MYR.
What is Inari Amertron Bhd's Capital Expenditures growth rate?
Capital Expenditures CAGR 10Y
-16%
Over the last year, the Capital Expenditures growth was -60%. The average annual Capital Expenditures growth rates for Inari Amertron Bhd have been -22% over the past three years , and -16% over the past ten years .
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