Inari Amertron Bhd
KLSE:INARI
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Inari Amertron Bhd
Total Current Liabilities
Inari Amertron Bhd
Total Current Liabilities Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Total Current Liabilities | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
I
|
Inari Amertron Bhd
KLSE:INARI
|
Total Current Liabilities
myr269.2m
|
CAGR 3-Years
-14%
|
CAGR 5-Years
6%
|
CAGR 10-Years
5%
|
|
|
U
|
Unisem (M) Bhd
KLSE:UNISEM
|
Total Current Liabilities
myr472.8m
|
CAGR 3-Years
4%
|
CAGR 5-Years
14%
|
CAGR 10-Years
2%
|
|
|
G
|
Globetronics Technology Bhd
KLSE:GTRONIC
|
Total Current Liabilities
myr23.3m
|
CAGR 3-Years
-14%
|
CAGR 5-Years
-11%
|
CAGR 10-Years
-10%
|
|
|
K
|
KESM Industries Bhd
KLSE:KESM
|
Total Current Liabilities
myr69.5m
|
CAGR 3-Years
21%
|
CAGR 5-Years
0%
|
CAGR 10-Years
0%
|
|
|
M
|
Malaysian Pacific Industries Bhd
KLSE:MPI
|
Total Current Liabilities
myr417.1m
|
CAGR 3-Years
-10%
|
CAGR 5-Years
11%
|
CAGR 10-Years
6%
|
|
|
D
|
D & O Green Technologies Bhd
KLSE:D&O
|
Total Current Liabilities
myr630.2m
|
CAGR 3-Years
27%
|
CAGR 5-Years
34%
|
CAGR 10-Years
12%
|
|
Inari Amertron Bhd
Glance View
Inari Amertron Bhd.is an investment holding company, which engages in the provision of manufacturing services. The company is headquartered in Bayan Lepas, Pulau Pinang and currently employs 5,677 full-time employees. The company went IPO on 2011-07-19. The firm provides semiconductor assembly and test (OSAT) service for the semiconductor industry covering radio frequency, fiber-optics transceivers, optoelectronics, sensors, and custom integrated circuit (IC) technologies. Its activities include wafer processing, chip fabrication and wafer certification in fiber optic chips, system in package assembly and test, and other services. Its wafer processing includes probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection. Its system in package assembly and test includes surface mount technology, high speed and high accuracy flip-chip dice placement, in-line post vision, molding underfill (MUF) and post-mold oxide plating, and final testing. Its other services include sensor and IC package design and characterization.
See Also
What is Inari Amertron Bhd's Total Current Liabilities?
Total Current Liabilities
269.2m
MYR
Based on the financial report for Jun 30, 2024, Inari Amertron Bhd's Total Current Liabilities amounts to 269.2m MYR.
What is Inari Amertron Bhd's Total Current Liabilities growth rate?
Total Current Liabilities CAGR 10Y
5%
Over the last year, the Total Current Liabilities growth was -19%. The average annual Total Current Liabilities growth rates for Inari Amertron Bhd have been -14% over the past three years , 6% over the past five years , and 5% over the past ten years .
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