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Inari Amertron Bhd
KLSE:INARI

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Inari Amertron Bhd
KLSE:INARI
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Price: 2.86 MYR -1.38% Market Closed
Market Cap: 10.8B MYR
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Inari Amertron Bhd
Short-Term Investments

Last Value
3-Years 3-Y CAGR
5-Years 5-Y CAGR
10-Years 10-Y CAGR
Quarterly
Annual
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Inari Amertron Bhd
Short-Term Investments Peer Comparison

Competitors Analysis
Latest Figures & CAGR of Competitors

Company Short-Term Investments CAGR 3Y CAGR 5Y CAGR 10Y
I
Inari Amertron Bhd
KLSE:INARI
Short-Term Investments
N/A
CAGR 3-Years
N/A
CAGR 5-Years
N/A
CAGR 10-Years
N/A
U
Unisem (M) Bhd
KLSE:UNISEM
Short-Term Investments
N/A
CAGR 3-Years
N/A
CAGR 5-Years
N/A
CAGR 10-Years
N/A
G
Globetronics Technology Bhd
KLSE:GTRONIC
Short-Term Investments
N/A
CAGR 3-Years
N/A
CAGR 5-Years
N/A
CAGR 10-Years
N/A
K
KESM Industries Bhd
KLSE:KESM
Short-Term Investments
myr14.3m
CAGR 3-Years
0%
CAGR 5-Years
16%
CAGR 10-Years
6%
M
Malaysian Pacific Industries Bhd
KLSE:MPI
Short-Term Investments
N/A
CAGR 3-Years
N/A
CAGR 5-Years
N/A
CAGR 10-Years
N/A
D
D & O Green Technologies Bhd
KLSE:D&O
Short-Term Investments
myr50.3m
CAGR 3-Years
107%
CAGR 5-Years
53%
CAGR 10-Years
21%
No Stocks Found

Inari Amertron Bhd
Glance View

Market Cap
10.7B MYR
Industry
Semiconductors

Inari Amertron Bhd.is an investment holding company, which engages in the provision of manufacturing services. The company is headquartered in Bayan Lepas, Pulau Pinang and currently employs 5,677 full-time employees. The company went IPO on 2011-07-19. The firm provides semiconductor assembly and test (OSAT) service for the semiconductor industry covering radio frequency, fiber-optics transceivers, optoelectronics, sensors, and custom integrated circuit (IC) technologies. Its activities include wafer processing, chip fabrication and wafer certification in fiber optic chips, system in package assembly and test, and other services. Its wafer processing includes probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection. Its system in package assembly and test includes surface mount technology, high speed and high accuracy flip-chip dice placement, in-line post vision, molding underfill (MUF) and post-mold oxide plating, and final testing. Its other services include sensor and IC package design and characterization.

INARI Intrinsic Value
2.5 MYR
Overvaluation 13%
Intrinsic Value
Price
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