Inari Amertron Bhd
KLSE:INARI
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Inari Amertron Bhd
Other Current Liabilities
Inari Amertron Bhd
Other Current Liabilities Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Other Current Liabilities | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
I
|
Inari Amertron Bhd
KLSE:INARI
|
Other Current Liabilities
myr86.5m
|
CAGR 3-Years
-34%
|
CAGR 5-Years
21%
|
CAGR 10-Years
2%
|
|
|
U
|
Unisem (M) Bhd
KLSE:UNISEM
|
Other Current Liabilities
myr7.5m
|
CAGR 3-Years
21%
|
CAGR 5-Years
N/A
|
CAGR 10-Years
3%
|
|
|
G
|
Globetronics Technology Bhd
KLSE:GTRONIC
|
Other Current Liabilities
myr20.5m
|
CAGR 3-Years
-13%
|
CAGR 5-Years
-3%
|
CAGR 10-Years
-5%
|
|
|
K
|
KESM Industries Bhd
KLSE:KESM
|
Other Current Liabilities
myr0
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
M
|
Malaysian Pacific Industries Bhd
KLSE:MPI
|
Other Current Liabilities
myr28.1m
|
CAGR 3-Years
-3%
|
CAGR 5-Years
19%
|
CAGR 10-Years
76%
|
|
|
D
|
D & O Green Technologies Bhd
KLSE:D&O
|
Other Current Liabilities
myr18.1m
|
CAGR 3-Years
-19%
|
CAGR 5-Years
16%
|
CAGR 10-Years
-3%
|
|
Inari Amertron Bhd
Glance View
Inari Amertron Bhd.is an investment holding company, which engages in the provision of manufacturing services. The company is headquartered in Bayan Lepas, Pulau Pinang and currently employs 5,677 full-time employees. The company went IPO on 2011-07-19. The firm provides semiconductor assembly and test (OSAT) service for the semiconductor industry covering radio frequency, fiber-optics transceivers, optoelectronics, sensors, and custom integrated circuit (IC) technologies. Its activities include wafer processing, chip fabrication and wafer certification in fiber optic chips, system in package assembly and test, and other services. Its wafer processing includes probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection. Its system in package assembly and test includes surface mount technology, high speed and high accuracy flip-chip dice placement, in-line post vision, molding underfill (MUF) and post-mold oxide plating, and final testing. Its other services include sensor and IC package design and characterization.
See Also
What is Inari Amertron Bhd's Other Current Liabilities?
Other Current Liabilities
86.5m
MYR
Based on the financial report for Jun 30, 2024, Inari Amertron Bhd's Other Current Liabilities amounts to 86.5m MYR.
What is Inari Amertron Bhd's Other Current Liabilities growth rate?
Other Current Liabilities CAGR 10Y
2%
Over the last year, the Other Current Liabilities growth was 57%. The average annual Other Current Liabilities growth rates for Inari Amertron Bhd have been -34% over the past three years , 21% over the past five years , and 2% over the past ten years .
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