I

Inari Amertron Bhd
KLSE:INARI

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Inari Amertron Bhd
KLSE:INARI
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Price: 2.86 MYR -1.38% Market Closed
Market Cap: 10.8B MYR
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Inari Amertron Bhd
Long-Term Debt

Last Value
3-Years 3-Y CAGR
5-Years 5-Y CAGR
10-Years 10-Y CAGR
Quarterly
Annual
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Inari Amertron Bhd
Long-Term Debt Peer Comparison

Competitors Analysis
Latest Figures & CAGR of Competitors

Company Long-Term Debt CAGR 3Y CAGR 5Y CAGR 10Y
I
Inari Amertron Bhd
KLSE:INARI
Long-Term Debt
myr15.3m
CAGR 3-Years
157%
CAGR 5-Years
12%
CAGR 10-Years
-12%
U
Unisem (M) Bhd
KLSE:UNISEM
Long-Term Debt
myr138m
CAGR 3-Years
19%
CAGR 5-Years
14%
CAGR 10-Years
6%
G
Globetronics Technology Bhd
KLSE:GTRONIC
Long-Term Debt
myr0
CAGR 3-Years
N/A
CAGR 5-Years
N/A
CAGR 10-Years
N/A
K
KESM Industries Bhd
KLSE:KESM
Long-Term Debt
myr34.2m
CAGR 3-Years
75%
CAGR 5-Years
17%
CAGR 10-Years
-1%
M
Malaysian Pacific Industries Bhd
KLSE:MPI
Long-Term Debt
myr47m
CAGR 3-Years
26%
CAGR 5-Years
N/A
CAGR 10-Years
N/A
D
D & O Green Technologies Bhd
KLSE:D&O
Long-Term Debt
myr152.5m
CAGR 3-Years
60%
CAGR 5-Years
35%
CAGR 10-Years
86%
No Stocks Found

Inari Amertron Bhd
Glance View

Market Cap
10.7B MYR
Industry
Semiconductors

Inari Amertron Bhd.is an investment holding company, which engages in the provision of manufacturing services. The company is headquartered in Bayan Lepas, Pulau Pinang and currently employs 5,677 full-time employees. The company went IPO on 2011-07-19. The firm provides semiconductor assembly and test (OSAT) service for the semiconductor industry covering radio frequency, fiber-optics transceivers, optoelectronics, sensors, and custom integrated circuit (IC) technologies. Its activities include wafer processing, chip fabrication and wafer certification in fiber optic chips, system in package assembly and test, and other services. Its wafer processing includes probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection. Its system in package assembly and test includes surface mount technology, high speed and high accuracy flip-chip dice placement, in-line post vision, molding underfill (MUF) and post-mold oxide plating, and final testing. Its other services include sensor and IC package design and characterization.

INARI Intrinsic Value
2.5 MYR
Overvaluation 13%
Intrinsic Value
Price
I

See Also

What is Inari Amertron Bhd's Long-Term Debt?
Long-Term Debt
15.3m MYR

Based on the financial report for Jun 30, 2024, Inari Amertron Bhd's Long-Term Debt amounts to 15.3m MYR.

What is Inari Amertron Bhd's Long-Term Debt growth rate?
Long-Term Debt CAGR 10Y
-12%

Over the last year, the Long-Term Debt growth was 1%. The average annual Long-Term Debt growth rates for Inari Amertron Bhd have been 157% over the past three years , 12% over the past five years , and -12% over the past ten years .

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