Inari Amertron Bhd
KLSE:INARI
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Inari Amertron Bhd
Current Portion of Long-Term Debt
Inari Amertron Bhd
Current Portion of Long-Term Debt Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Current Portion of Long-Term Debt | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
I
|
Inari Amertron Bhd
KLSE:INARI
|
Current Portion of Long-Term Debt
myr136k
|
CAGR 3-Years
-61%
|
CAGR 5-Years
-53%
|
CAGR 10-Years
-35%
|
|
|
U
|
Unisem (M) Bhd
KLSE:UNISEM
|
Current Portion of Long-Term Debt
myr48.9m
|
CAGR 3-Years
-22%
|
CAGR 5-Years
-6%
|
CAGR 10-Years
-15%
|
|
|
G
|
Globetronics Technology Bhd
KLSE:GTRONIC
|
Current Portion of Long-Term Debt
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
K
|
KESM Industries Bhd
KLSE:KESM
|
Current Portion of Long-Term Debt
myr39.1m
|
CAGR 3-Years
74%
|
CAGR 5-Years
-3%
|
CAGR 10-Years
1%
|
|
|
M
|
Malaysian Pacific Industries Bhd
KLSE:MPI
|
Current Portion of Long-Term Debt
myr96.3m
|
CAGR 3-Years
5%
|
CAGR 5-Years
15%
|
CAGR 10-Years
-1%
|
|
|
D
|
D & O Green Technologies Bhd
KLSE:D&O
|
Current Portion of Long-Term Debt
myr76.4m
|
CAGR 3-Years
39%
|
CAGR 5-Years
31%
|
CAGR 10-Years
50%
|
|
Inari Amertron Bhd
Glance View
Inari Amertron Bhd.is an investment holding company, which engages in the provision of manufacturing services. The company is headquartered in Bayan Lepas, Pulau Pinang and currently employs 5,677 full-time employees. The company went IPO on 2011-07-19. The firm provides semiconductor assembly and test (OSAT) service for the semiconductor industry covering radio frequency, fiber-optics transceivers, optoelectronics, sensors, and custom integrated circuit (IC) technologies. Its activities include wafer processing, chip fabrication and wafer certification in fiber optic chips, system in package assembly and test, and other services. Its wafer processing includes probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection. Its system in package assembly and test includes surface mount technology, high speed and high accuracy flip-chip dice placement, in-line post vision, molding underfill (MUF) and post-mold oxide plating, and final testing. Its other services include sensor and IC package design and characterization.
See Also
What is Inari Amertron Bhd's Current Portion of Long-Term Debt?
Current Portion of Long-Term Debt
136k
MYR
Based on the financial report for Jun 30, 2024, Inari Amertron Bhd's Current Portion of Long-Term Debt amounts to 136k MYR.
What is Inari Amertron Bhd's Current Portion of Long-Term Debt growth rate?
Current Portion of Long-Term Debt CAGR 10Y
-35%
Over the last year, the Current Portion of Long-Term Debt growth was -55%. The average annual Current Portion of Long-Term Debt growth rates for Inari Amertron Bhd have been -61% over the past three years , -53% over the past five years , and -35% over the past ten years .
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