Inari Amertron Bhd
KLSE:INARI
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| 52 Week Range |
2.72
3.9812
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Inari Amertron Bhd
Cash
Inari Amertron Bhd
Cash Peer Comparison
Competitors Analysis
Latest Figures & CAGR of Competitors
| Company | Cash | CAGR 3Y | CAGR 5Y | CAGR 10Y | ||
|---|---|---|---|---|---|---|
|
I
|
Inari Amertron Bhd
KLSE:INARI
|
Cash
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
U
|
Unisem (M) Bhd
KLSE:UNISEM
|
Cash
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
G
|
Globetronics Technology Bhd
KLSE:GTRONIC
|
Cash
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
K
|
KESM Industries Bhd
KLSE:KESM
|
Cash
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
M
|
Malaysian Pacific Industries Bhd
KLSE:MPI
|
Cash
N/A
|
CAGR 3-Years
N/A
|
CAGR 5-Years
N/A
|
CAGR 10-Years
N/A
|
|
|
D
|
D & O Green Technologies Bhd
KLSE:D&O
|
Cash
myr181.9m
|
CAGR 3-Years
49%
|
CAGR 5-Years
37%
|
CAGR 10-Years
21%
|
|
Inari Amertron Bhd
Glance View
Inari Amertron Bhd.is an investment holding company, which engages in the provision of manufacturing services. The company is headquartered in Bayan Lepas, Pulau Pinang and currently employs 5,677 full-time employees. The company went IPO on 2011-07-19. The firm provides semiconductor assembly and test (OSAT) service for the semiconductor industry covering radio frequency, fiber-optics transceivers, optoelectronics, sensors, and custom integrated circuit (IC) technologies. Its activities include wafer processing, chip fabrication and wafer certification in fiber optic chips, system in package assembly and test, and other services. Its wafer processing includes probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection. Its system in package assembly and test includes surface mount technology, high speed and high accuracy flip-chip dice placement, in-line post vision, molding underfill (MUF) and post-mold oxide plating, and final testing. Its other services include sensor and IC package design and characterization.
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