BE Semiconductor Industries NV
AEX:BESI
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P/OCF
Price to Operating Cash Flow (P/OCF) ratio compares a company`s market value to the cash it generates from its core operations.
Price to Operating Cash Flow (P/OCF) ratio compares a company`s market value to the cash it generates from its core operations.
Valuation Scenarios
If P/OCF returns to its 3-Year Average (47), the stock would be worth €134.51 (47% downside from current price).
| Scenario | P/OCF Value | Implied Price | Upside/Downside |
|---|---|---|---|
| Current Multiple | 88.2 | €252.2 |
0%
|
| 3-Year Average | 47 | €134.51 |
-47%
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| 5-Year Average | 29.7 | €84.84 |
-66%
|
| Industry Average | 36.5 | €104.31 |
-59%
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| Country Average | 11.2 | €31.91 |
-87%
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Forward P/OCF
Today’s price vs future operating cash flow
Peer Comparison
| Market Cap | P/OCF | P/E | ||||
|---|---|---|---|---|---|---|
| NL |
|
BE Semiconductor Industries NV
AEX:BESI
|
20B EUR | 88.2 | 131.8 | |
| NL |
|
ASML Holding NV
AEX:ASML
|
481.6B EUR | 34.8 | 47.2 | |
| US |
|
Lam Research Corp
NASDAQ:LRCX
|
334.9B USD | 48.2 | 49.9 | |
| US |
|
Applied Materials Inc
NASDAQ:AMAT
|
331B USD | 38 | 42.2 | |
| US |
|
KLA Corp
NASDAQ:KLAC
|
253.8B USD | 53.2 | 55.7 | |
| US |
B
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Brooks Automation Inc
LSE:0HQ1
|
234.5B USD | 3 757.9 | -4 053.1 | |
| JP |
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Advantest Corp
TSE:6857
|
21.4T JPY | 64 | 74.1 | |
| JP |
|
Tokyo Electron Ltd
TSE:8035
|
21T JPY | 42 | 41.8 | |
| US |
|
Teradyne Inc
NASDAQ:TER
|
65.3B USD | 96.7 | 117.7 | |
| CN |
|
NAURA Technology Group Co Ltd
SZSE:002371
|
344.2B CNY | 157.9 | 61 | |
| JP |
|
Disco Corp
TSE:6146
|
7.8T JPY | 58.2 | 57.4 |
Market Distribution
| Min | 0.1 |
| 30th Percentile | 6.7 |
| Median | 11.2 |
| 70th Percentile | 19.4 |
| Max | 387.8 |
Other Multiples
BE Semiconductor Industries NV
Glance View
In the ever-evolving realm of semiconductor equipment manufacturing, BE Semiconductor Industries NV (BESI) stands out as a pivotal player, masterfully orchestrating its operations from its headquarters in the Netherlands. Founded in 1995, BESI has carved out a niche for itself by specializing in advanced packaging and assembly equipment for the semiconductor industry. This Dutch firm is essentially the lifeline for semiconductor manufacturers, as it provides the necessary tools to enhance the functionality, performance, and reliability of microchips used across various applications—from smartphones to data centers, all the way to automotive technology. BESI's cutting-edge, high-precision machinery is designed to facilitate the highly complex process of chip packaging, which involves encapsulating chips and integrating them with the necessary electrical connections to form a complete and functional device. The company prides itself on innovation and continuous improvement, often working hand-in-hand with its clients to meet the ever-expanding demands for more sophisticated and efficient semiconductor solutions. Revenue streams for BESI are diversified, but fundamentally revolve around the sale and servicing of its highly specialized equipment. The company's product segments include die attach systems, packaging systems, and plating systems, each essential at different stages of semiconductor assembly. Beyond the initial equipment sale, BESI fosters enduring client relationships through its comprehensive aftersales service, ensuring that its sophisticated machines remain operational and effective over the long term. Moreover, BESI has strategically positioned itself in key technology hubs around the globe, enabling it to capitalize on the burgeoning semiconductor demand from Asia, Europe, and the Americas. The firm’s financial health is bolstered not only by equipment sales but also by recurring revenues from high-margin service contracts, spare parts, and technical support services, embedding BESI deeply into the fabric of the semiconductor production process and assuring its sustained relevance in an industry that is both capital and knowledge-intensive.